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Introduction to Nanomaterials
Nanomaterials, defined as materials engineered at the nanoscale (approximately 1 to 100 nanometers), have revolutionized science, engineering, and technology. At these incredibly small dimensions, materials exhibit unique and enhanced physical, chemical, and biological properties compared to their larger-scale counterparts.
Due to their high surface-area-to-volume ratio, nanomaterials demonstrate superior reactivity, strength, electrical conductivity, and optical characteristics, making them invaluable in various industries. They play critical roles in electronics, healthcare, energy, environmental sustainability, and advanced manufacturing.
For instance, silver nanoparticles exhibit powerful antimicrobial properties, finding wide applications in medical devices, textiles, and coatings. Graphene, another popular nanomaterial, boasts exceptional electrical conductivity and mechanical strength, enhancing products from batteries and sensors to composite materials.
As research and innovation in nanotechnology continue to expand, the potential applications of nanomaterials are virtually limitless. Their integration promises advancements that could significantly impact global challenges, including renewable energy solutions, environmental remediation, targeted drug delivery systems, and next-generation electronics.
In conclusion, nanomaterials represent a critical frontier in modern technology, offering transformative opportunities for innovation and improvement in quality of life across the globe.
| Graphene Sheet, Size: 1 cm x 1 cm, Thickness: 35 µm, Highly Conductive |
| Nitinol Shape Memory Alloy Sheet, Thickness: 2 mm, AF: -10 – -15°C |
| Magnesium Hydroxide (Mg(OH)2) Micron Powder, Purity: 99.95+%, Size: 325 mesh |
| Silicon Carbide (SiC) Micron Powder, Purity: 99,9%, Size: 250 µm |
| Nitinol Shape Memory Alloy Sheet, Thickness: 1 mm, AF: 50-55°C |
| Nitinol Shape Memory Alloy Sheet, Thickness: 0,5 mm, AF: 80-85°C |
| Nitinol Shape Memory Alloy Sheet, Thickness: 0,5 mm, AF: 35-40°C |
| Magnesium Carbonate (MgCO3) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Iron Oxide (Fe2O3) Micron Powder, Gamma, Purity 99.9+%, Size: 325 mesh |
| Activated Carbon (C) Nanopowder/Nanoparticles, Purity: 95%, Size: <100 nm, Charcoal |
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| Natural Graphite (C) Nanopowder/Nanoparticles, Purity: 99.9% Size: 380 nm-1.2 um |
| Iron Oxide (Fe3O4) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Nitinol Shape Memory Alloy Sheet, Thickness: 0,15 mm, AF: 15-20°C |
| Silicon Carbide (SiC) Micron Powder, Purity: 99,9%, Size: 1 µm |
| Antibacterial Nanopowder/Nanoparticles, Size: 100 nm |
| Copper Tin (Cu:85-Sn:15) Alloy Micron Powder, Purity: 99.5+%, Size: 325 mesh |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.55%, Size: 78 nm, Hydrophilic |
| Iron Oxide (Fe2O3) Micron Powder, Gamma, Purity: 99.9+%, Size: 1 µm |
| Graphene Nanoplatelet, Purity: 99.9%, Size: 3 nm, S.A: 800 m2/g, Dia: 1.5 μm |
| Coin Style Single Wafer Shipper, 3’’ / 76 mm , Natural PP |
| Titanium Dioxide (TiO2) Micron Powder, Purity: 99.5+ %, Size: 325 mesh |
| Copper Tin (Bronze, Cu:80-Sn:20) Alloy Micron Powder, Purity: 99.95%, Size: 325 mesh |
| Titanium Diboride (TiB2) Micron Powder, Purity: 99.5+%, Size: 40-50 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.95+%, Size: 50-100 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: 10 µm, Fused |
| Coin Style Single Wafer Shipper, 2’’ / 51 mm , Natural PP |
| Copper (Cu) Micron Powder, Purity: 99.9 %, Size: 325 mesh, Spherical |
| Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP |
| Samarium Oxide (Sm2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Titanium Diboride (TiB2) Micron Powder, Purity: 99.5+%, Size: 200 mesh |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 3 nm, S.A: 320 m2/g, Dia: 1.5 μm |
| Boron Carbide (B4C) Micron Powder, Purity: 95+%, Size: 325 mesh |
| Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP |
| Coin Style Single Wafer Shipper, 4’’ / 100 mm , Natural PP |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 135 m2/g, Dia: 7 μm |
| Tellurium Dioxide (TeO2) Micron Powder, Purity: 99.95 %, Size: 1-5 µm |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 3 nm, S.A: 530 m2/g, Dia: 1.5 μm |
| Tellurium (Te) Micron Powder, Purity: 99.95 %, Size: 325 mesh |
| Boron Carbide (B4C) Micron Powder, Purity: 99.95%, Size: < 10 µm |
| Iron Oxide (Fe3O4) Micron Powder, Purity: 99.5+%, Size: 1 µm |
| Nickel (Ni) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Silicon Nitride (Si3N4) Micron Powder, Beta, Purity: 99.9%, Size: 10 µm |
| Nickel (Ni) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Porous Carbon (C) Nanopowder/Nanoparticles, Size: 18-38 nm, (Plant) |
| Graphene Sheet, Size: 5cm x 5cm, Thickness: 35 µm, Highly Conductive |
| Nanocalcite, Purity: 99.9%, Size: <200 nm |
| Silicon Nitride (Si3N4) Micron Powder, Beta, Purity: 99.9%, Size: 325 mesh |
| Strontium Titanate (SrTiO3) Micron Powder, Purity: 99.9+%, Size: 3 µm |
| Boron Carbide (B4C) Micron Powder, Purity: 95+%, Size: 250 µm |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 135 m2/g, Dia: 30 μm |
| Conductive Carbon Black Nanopowder/Nanoparticles, Purity: 95%, Size: 148 nm (Plant) |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 170 m2/g, Dia: 7 μm |
| AZ91 Magnesium Alloy Powder, Purity: 99.95%, Size: 15-53 μm |
| Graphite Micron Powder, Purity: 99.9%, Size: 5-10 µm |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 135 m2/g, Dia: 18 μm |
| Water-_19_.webp |
| Lanthanum Oxide (La2O3) Micron Powder, Purity: 99.99%, Size: 1-10 μm |
| Titanium Carbide (TiC) Micron Powder, Purity: 99,9+%, Size: 325 mesh |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 170 m2/g, Dia: 18 μm |
| Cobalt (Co) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 28 nm, Partially Passivated |
| Hydroxyapatite Powder, Purity: 99.5+%, Size: 40-50 µm |
| Hydroxyapatite Powder, Purity: 99.5+%, Size: 10-20 µm |
| Copper Oxide (CuO) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 38 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, Purity: 99.5+%, Size: 78 nm, Hydrophilic |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 170 m2/g, Dia: 30 μm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.5+%, Size: 18 nm, Hydrophilic |
| Manganese (Mn) Micron Powder, Purity: 99.95%, Size: 35 µm, Metal Basis |
| Indium Hydroxide (In(OH)3) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Sulphur (S) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 3 µm |
| Tungsten Carbide (WC) Micron Powder, Purity: 99,9%, Size: -325 mesh |
| Molybdenum (Mo) Micron Powder, Purity: 99.95%, Size: 1-10 µm, Metal Basis |
| Barium Ferrite (BaFe12O19) Micron Powder, Purity: 99.9+%, Size: 1-3 µm |
| Titanium Carbide (TiC) Micron Powder, Purity: 99.99%, Size: 1 µm |
| Nickel (Ni) Micron Powder, Purity: 99.95 %, Size: 500 Mesh, Spherical |
| Titanium Hydride (TiH2) Micron Powder, Purity: 99.5%, Size: 325 mesh |
| Activated Carbon (C) Nanopowder/Nanoparticles, Size: < 90 nm, Coconut |
| Graphene Sheet, Size: 10 cm x 10 cm, Thickness: 35 µm, Highly Conductive |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: Sub-Micron, Fused |
| Silicon Dioxide(SiO2) Micron Powder, Size: -325 mesh,Purity: 99.9% |
| PTFE Nanopowder/Nanoparticles [Polytetrafluoroethylene, (C2F4)n)], Purity: 99.9% |
| Chromium (Cr) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Conductive Bakelite Powder |
| Hydroxyapatite Micron Powder, Purity: 99.5+%, Size: 3 µm |
| Strontium Iron Oxide (SrFe12O19) Micron Powder, Purity: 99.9+%, Size: 1-3 µm |
| Barium (Ba) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 55 µm |
| Copper Oxide (CuO) Micron Powder, Purity: 99.5%, Size: 20 µm |
| Aluminum (Al) Micron Powder, Purity: 99.9+%, Size: 20-35 µm |
| Cuprous Oxide (Cu2O) Micron Powder, Purity: 99.99 %, Size: -200 mesh |
| Neodymium (Nd) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.9+%, Size: 1-2 µm |
| Boron Carbide (B4C) Micron Powder, Purity: 95+%, Size: 1-3 µm |
| Calcium Oxide (CaO) Micron Powder, Purity: 99.95+ %, Size: < 5 µm |
| Molybdenum Disilicide (MoSi2) Micron Powder, Purity: 99.5+%, Size: 1-10 µm |
| Silicon Dioxide (SiO2) Micron Powder, Size: <15 Micron, Purity: 99.8% |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 30 µm |
| Niobium (Nb) Micron Powder, Purity: 99.95%, Size: 45 µm, Metal Basis |
| Sodium Dodecyl Sulfate Micron Powder, Size: -325 mesh |
| Chromium(III) oxide (Cr2O3) Micron Powder, Purity: 99%, Average Particle Size: 4.5µm |
| Carbon Nanotubes Doped with 12 wt% Graphene Nanopowder/Nanoparticles |
| Lithium Metaborate (LiBO2) Nanopowder/Nanoparticles, Purity: 99.95+ %, Size: 500 nm, Metals Basis |
| Niobium (Nb) Micron Powder, Purity: 99.95 %, Size: 10 µm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Water, Alpha, Size: 28 nm, 22 wt% |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 90 nm, Cubic |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 280 nm, Tetragonal |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 370 nm, Tetragonal |
| Molybdenum Disulfide (MoS2) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 500 nm, Tetragonal |
| Silicon (Si) Micron Powder, Purity: 99.95%, Size: 1-3 um, Polycrystalline |
| Aluminum (Al) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.95 %, Size: 70 µm |
| Nickel Iron Oxide (NiFe2O4) Nanopowder/Nanoparticles, Purity: 98.99%, Size: 25 nm |
| Bismuth (Bi) Micron Powder, Purity: 99.9 %, Size: 200 mesh |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: < 55 nm |
| Iron Oxide (Fe3O4) Nanopowder/Nanoparticles, Purity: 98.45+%, Size: 18-28 nm |
| Iron Oxide (Fe2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.55%, Size: 18-38 nm |
| Antimony (III) Oxide (Sb2O3) Micron Powder, Purity: 99.9%, Size: 3 µm |
| Graphite (C) Micron Powder, Purity: 99.9%, Size: 1-5 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 600-850 μm |
| Phosphorus (P) Micron Powder, Purity: 99.95%, Size: 1 µm, Metal Basis |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 300-425 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 250-355 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 212-300 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 180-250 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 850-1180 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 150-212 μm |
| Lithium Hydroxide, Monohydrate (Battery Grade, LiOH.H2O), Purity: ≥ 99.0% |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 125-180 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 90-125 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 63-106 μm |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 53-90 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1180-1700 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1400-2000 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 45-75 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 34-82 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 28-70 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 22-59 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 16-49 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 12-40 μm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 8-32 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 5-25 μm |
| Activated Carbon Micron Powder, Size: 8-30 Mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 3-19 μm |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 200 mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 2-14 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 355-500 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 425-600 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 500-710 μm |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 3 µm |
| Nickel Chromium (Ni-Cr) Alloy Micron Powder, Size: 325 mesh, Ni-80%, Cr-20% |
| Tin (Sn) Micron Powder, Purity: 99.95 %, Size: 1 µm |
| Zinc (Zn) Nanopowder/Nanoparticles, Purity: 99.95%,Size: 790 nm |
| Gadolinium Oxide (Gd2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Zinc Iron Oxide (ZnFe2O4) Nanopowder/Nanoparticles, Purity: 98.7%, Size: 8-28 nm |
| Aluminum (Al) Micron Powder, Purity: 99.95 %, Size: 80 µm |
| Iron (Fe) Micron Powder, Purity: 99.5+ %, Size: 325 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.95+ %, Size: 14 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 106-150 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1000-1400 μm |
| Nickel Oxide (NiO) Micron Powder, Purity: 99.9 %, Size: 200 mesh, Black |
| Manganese (Mn) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Calcium Oxide (CaO) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Holmium (Ho) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, S-type, Spherical, Purity: 99.95+%, Size: 13-22 nm, Nonporous and Amorphous |
| Aluminum Oxide (Al2O3) Micron Powder, Alpha, Purity: 99.9%, Size: 20 µm |
| Aluminum (Al) Micron Powder, Purity: 99.9+%, Size: 9-11 µm |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 10 µm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, P-type, Purity: 99.65+%, Size: 13-23 nm, Porous and Amorphous |
| Calcium Copper Titanate (CaCu3Ti4O12) Micron Powder, D50:1-3um, Purity: ≥ 99.5 % |
| Samarium Oxide (Sm2O3) Nanopowder/Nanoparticles, Purity: 99.955%, Size: 13-47 nm |
| Praseodymium Oxide (Pr6O11) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 8-110 nm |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Micron Powder, Purity: 99.9+%, Size: 20 µm |
| Tin (Sn) Micron Powder, Purity: 99.95 %, Size: 15 µm |
| Zinc Oxide (ZnO) Micron Powder, Purity: 99.5%, Size: 325 mesh, White |
| Molybdenum Trioxide (MoO3) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95+%, Size: 20 nm, metal basis |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 20-40 nm |
| Carbon Nanofibers, Purity: > 95%, Outside Diameter: 50-150 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Aluminum (Al) Micron Powder, Purity: 99.99 %, Size: 325 mesh, Spherical |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Zirconium (Zr) Micron Powder, Purity: 99.5%, Size: 80 µm, Metal Basis |
| Activated Carbon Micron Powder, Size: 4000 µm |
| Vulcan XC72 Conductive Carbon Black |
| Lanthanum Oxide (La2O3) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 8-190 nm |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 10 µm |
| Boron Nitride (BN) Micron Powder, Purity: 99.7%, Size: 40-50 µm, Hexagonal |
| Activated Carbon Micron Powder, Size: 2000 µm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 780 nm, Metal Basis |
| Zinc Ferrite (ZnFe2O4) Micron Powder, Zinc Iron Oxide Micron Powder, -200 mesh, 99.9% |
| Activated Carbon Micron Powder, Size: 1500 µm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 28-48 nm, Metal Basis |
| Titanium Dioxide (TiO2) Micron Powder, Purity: 99.5+%, Size: 20 µm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 28-48 nm, w/~0.25% PVP |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.95%, Size: 290 nm, Hydrophilic |
| Polyether Ether Ketone (PEEK) Micron Powder, Purity: 99.95+ %, Size: <325 mesh |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 48-78 nm, metal basis |
| Barium Carbonate (BaCO3) Nanopowder/Nanoparticles, Purity: 99.98%, Size: 780 nm |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 7 µm |
| Cadmium (Cd) Micron Powder, Purity: 99.99 %, Size: 200 mesh, Irregular |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 790 nm |
| Chromium (Cr) Micron Powder, Purity: 99.9 %, Size: 10 µm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm, w/~0.25% PVP |
| Tungsten Disulfide Micron powder, WS2, 99.9%, 325 mesh |
| Tin Oxide (SnO2) Nanopowder/Nanoparticles, High Purity: 99.87%, Size: 30-60 nm |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 5 µm |
| Copper Oxide (CuO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: < 77 nm |
| Magnesium Hydroxide (Mg(OH)2) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8 nm |
| Silver (Ag) Micron Powder, Purity: 99.99 %, Size: Sub-Micron |
| Lithium Titanium Oxide (Li4Ti5O12) Micron Powder for Li-ion Battery Anode (LTO) |
| Bismuth Oxide (Bi2O3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 75-195 nm |
| Aluminum Hydroxide (Al(OH)3) Nanopowder/Nanoparticles, High Purity: 99.95%, Size: 8-18 nm, Hydrophilic |
| Silver-_Ag_-Micron-Powder-99.9_-1-3-um.webp |
| Silver (Ag) Micron Powder, Purity: 99.9 %, Size: 1-3 µm |
| Porous Carbon (C) Nanopowder/Nanoparticles, Purity: 95%, Size: 55-75 nm, (Plant) |
| Praseodymium Oxide (Pr6O11) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 13-57 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Amorphous, Purity: 98.5+%, Size: 55-75 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Amorphous, Purity: 99.5+%, Size: 15-35 nm |
| Tungsten Oxide (WO3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 55 nm, Tetragonal |
| Selenium (Se) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Zirconium Hydride (ZrH2) Micron Powder, Purity: 99.5+%, Thickness: 1- 10 µm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.95%, Size: 136 nm, Hydrophilic |
| Titanium (Ti) Micron Powder, Purity: 99.5+%, Size: 325 mesh |
| Antimony (Sb) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 90nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Manganese Iron Oxide (MnFe2O4) Nanopowder/Nanoparticles, Purity: 98.95%, Size: 55 nm |
| Nickel (Ni) Micron Powder, Purity: 99.5+%, Size: 325 mesh, Spherical |
| Boron (B) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 450 nm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 34-82 μm |
| Graphite (C) Micron Powder, Purity: ≥99.99%, Size: < 45 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 1400-2000 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+% , Size: 1180-1700 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 1000-1400 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 850-1180 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 600-850 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 500-710 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 425-600 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 355-500 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 300-425 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 250-355 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 212-300 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 180-250 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 150-212 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 125-180 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 106-150 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 90-125 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 63-106 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 53-90 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 45-75 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 28-70 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 22-59 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99+%, Size: 16-49 µm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 12-40 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 8-32 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 5-25 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 3-19 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 2-14 μm |
| Manganese Ferrite Black Oxide Micron Powder, (Fe,Mn)3O4, 94+%, -325 mesh |
| Nickel Oxide (NiO) Micron Powder, Purity: 99.9 %, Size: 325 mesh, Green |
| Yttrium Oxide (Y2O3) Nanopowder/Nanoparticles, Purity: 99.999%, Size: 25-50 nm |
| Nickel Oxide (NiO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8-18 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Purity: 95.9+%, Size: 18-35 nm, KH570 Coated |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: < 90 nm |
| Antimony-Oxide-400-nm-99-.webp |
| Antimony Oxide (Sb2O3) Nanopowder/Nanoparticles, Purity: 99+%, Size: 400 nm |
| Zirconium (II) Hydride (ZrH2) Micron Powder, Purity: 99.9+%, Size: <10 µm |
| Cerium Oxide (CeO2) Nanopowder/Nanoparticles Water Dispersion, Size: 25-45 nm, 22 wt% |
| Nickel Oxide (NiO) Nanopowder/Nanoparticles, High Purity: 99.55+%, Size: 10-40 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Amorphous, Size: 45 nm, Al2O3: 92 wt%, H2O: 6-7 wt% |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 18 nm |
| Hafnium Oxide (HfO2) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 55-75 nm |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 35 nm |
| Tungsten Carbide (WC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 55 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Purity: 96.3+%, Size: 18-35 nm, KH550 Coated |
| Barium Titanate (BaTiO3) Micron Powder, Purity: > 99 %, Size: 1-3 µm |
| Hafnium Oxide (HfO2) Micron Powder, Purity: 99.9+%, Size: 1 µm |
| Silver (Ag) Doped Antibacterial Nanopowder/Nanoparticles, Size: 100 nm |
| Hydroxyapatite Nanopowder/Nanoparticles, Needle Type, Purity: 96%, Size: 200 nm |
| Zinc Ferrite (ZnFe2O4) Micron Powder, Zinc Iron Oxide Micron Powder, -325 mesh, 99.9% |
| Iron (Fe) Micron Powder, Purity: 99%, Size: 100 mesh |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: %99.99, Size: 20-30 nm, 167 ppm |
| Activated Carbon & Carbon Nanotube Mixed |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Molybdenum (Mo) Micron Powder, Purity: 99.95 %, Size: 20 µm |
| Titanium Silicon Carbide (Ti3SiC2) Micron Powder, Purity: 99.5+%, Size: < 325 mesh |
| Aligned Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm, Length 9-14 µm |
| C-NERGY Super P Conductive Carbon Black, 1 bag: 40 g |
| Titanium Diboride (TiB2) Micron Powder, Purity: 98.5+%, Size: 2.5-13 μm |
| Zinc Oxide (ZnO) Nanopowder Dispersion in Ethanol, Size: 20-30nm, 20wt% |
| Magnesium Oxide (MgO) Micron Powder, Purity: 99.99 %, Size: 500 nm – 1500nm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95% , Size: 45-75 nm, w/~0.25% PVP |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5+%, Size: 790 nm |
| Silica (SiO2) Micron Powder, Spherical, APS: 0.3um, SiO2 Content:99.5+% |
| Terbium Oxide (Tb4O7) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Lithium Fluoride Powder, Size: <100 μm, Purity: 99.95 % |
| Yttrium (Y) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Cerium Oxide (CeO2) Micron Powder, Purity: 99.99%, Size: 325 mesh, White |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.95%, Size: 180 nm, Hydrophilic |
| C-NERGY SUPER C45 Conductive Carbon Black (set: 80 g) |
| KETJENBLACK EC-300J Conductive Carbon Black |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 100 mesh |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Holmium Oxide (Ho2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha/Gamma, Size: 48 nm, 85% Alpha, 15% Gamma |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 1 µm |
| Tungsten Disulfide (WS2) Micron Powder, Purity: 99.9%, Size: 1 µm |
| Lanthanum (La) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Titanium Aluminum Carbide (Ti2AlC) Micron Powder, Purity: 99.9+%, Size: 50 µm |
| Aluminum Nitride (AlN) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 60-70 nm, Hexagonal |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm, Partially Passivated |
| Hydroxyapatite Nanopowder/Nanoparticles, Purity: 95% min, Size: 50 nm |
| Antimony Tin Oxide (ATO) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 20-50 nm |
| Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 780 nm, metal basis |
| Chromium (Cr) Micron Powder, Purity: 99.9 %, Size: 15-60 µm, Spherical |
| Tungsten Carbide Cobalt (WC/Co) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 35-75 nm |
| Nanoclay, Purity: 99.9%, Size: 800 nm |
| Boron Nitride (BN) Nanopowder/Nanoparticles, Purity: 99.7%, Size: 790 nm, Hexagonal |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1-10 μm |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 45 nm, Cubic |
| Gadolinium Oxide (Gd2O3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 13-95 nm |
| Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles Water Dispersion, Size: 40-50 nm, 22 wt% |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Neodymium Oxide (Nd2O3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 25-40 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.995%, Size: 4 nm, Hydrophilic |
| P25 Titanium Dioxide Nanopowder (TiO2) Purity 99.5+ % Size 20 nm |
| Lanthanum Oxide (La2O3) Nanopowder/Nanoparticles, Purity: 99.995%, Size: < 180 nm |
| Erbium Oxide (Er2O3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 8-90 nm, Cubic |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 50-150 µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 50-150 µm |
| Manganese Dioxide (MnO2) Micron Powder, Purity: 99 %, Size: 200 mesh |
| Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles, Purity: 99.95+ %, Size: 30 nm |
| Titanium Nitride (TiN) Nanopowder/Nanoparticles, Purity: 99.2+%, Size: 20 nm, Cubic |
| Titanium Carbide (TiC) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 35-55 nm, Cubic |
| Tantalum Carbide (TaC) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 950 nm, Cubic |
| Molybdenum Oxide (MoO3) Nanopowder/Nanoparticles, High Purity: 99.96+%, Size: 8-75 nm |
| CR2025 Coin Cell Cases (Positive and Negative Cases), Materials: 304SS |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8-28 nm |
| Chromium Oxide (Cr2O3) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 55 nm, Hexagonal |
| Nickel (II) Hydroxide (Ni(OH)2) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18 nm, Beta |
| Selenium Dioxide (SeO2) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 0.5 wt% |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles Water Dispersion, Size: 25-35 nm, 22 wt% |
| Boron Carbide (B4C) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 40-60 nm, Hexagonal |
| Titanium (Ti) Micron Powder, Purity: 99.5+%, Size: 200 mesh |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5%, Size: 20 nm, Laser Synthesized |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 22 nm, Partially Passivated |
| Yttrium Oxide (Y2O3) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18-38 nm |
| Nitinol Shape Memory Alloy Wire, Diameter: 2 mm, AF: 80-85°C |
| KETJENBLACK EC-600JD Conductive Carbon Black |
| Strontium Titanate (SrTiO3) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 300-500 nm |
| Iron Oxide (Fe3O4) Nanopowder/Nanoparticles, High Purity: 99.55+%, Size: 14-29 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile:99.5+%, Size: 200 nm |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, Purity: 99.75%, Size: 48 nm |
| Dysprosium Oxide (Dy2O3) Nanopowder/Nanoparticles, High Purity: 99.95+%, Size: 28 nm |
| Iron Oxide (Fe2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.6+%, Size: 28 nm |
| Iron Oxide (Fe2O3) Nanopowder/Nanoparticles, Gamma, High Purity: 99.55+%, Size: 18 nm |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Polymer Dispersant for Dispersion of Carbon Nanotubes (CNTs) in Ester Solvents |
| Tin Oxide (SnO2) Nanopowder/Nanoparticles, Purity: 99.97%, Size: 430 nm |
| 304 Stainless Steel Wave Spring (Belleville Washers) for CR2032, Diameter: 15.4 mm, Thickness: 0.2 mm, Height: (1.2±0.03) mm |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, Purity: 99.77%, Size: 48 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 10-30 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 0.5 mg/mL |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 30-60 µm |
| Calcium Copper Titanate (CaCu3Ti4O12) Nano Powder, D50: 360 nm, Purity: ≥ 99.5 % |
| Multi Walled Carbon Nanotubes Water Dispersion, 4 wt%, Purity: > 96%, OD: 45-75 nm, Length: 8-18 µm |
| Multi Walled Carbon Nanotubes, Purity: > 95%, Outside Diameter: 30-50 nm |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 18 nm, KH550 |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.125” |
| Lithium Carbonate (Battery Grade, Li2CO3) Purity ≥99.5% |
| Activated Carbon Micron Powder, Size: 200 Mesh |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 30-60 µm |
| Iron Nickel (Fe-Ni) Alloy Powder, Purity: 99.9%, Size: 325 mesh, Fe/Ni: 5:5 |
| Tin (Sn) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Graphene NMP Dispersion, Purity: 99.5%, Graphene: 0.5 wt% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Ethylene Glycol, Size: 12 nm, Anatase, 22 wt % |
| Tungsten (W) Micron Powder, Purity: 99.95 %, Size: 2 µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 10-25 µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 15-45 µm |
| Tungsten Oxide (WO3) Micron Powder, Purity: 99.99%, Size: 3 µm |
| Lithium Manganese Oxide (LiMn2O4) Powder for Li-ion Battery Cathode Application |
| Europium Oxide (Eu2O3) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 8-90 nm, Cubic |
| Lead (Pb) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Gadolinium Oxide (Gd2O3) Micron Powder, Purity: 99.99%, Size: 2-3 μm |
| Calcium Oxide (CaO) Nanopowder/Nanoparticles, Purity: 99.95+%, Size: 10-70 nm |
| Nitinol Shape Memory Alloy Wire, Diameter: 1 mm, AF: 15-20°C |
| Copper Oxide (CuO) Nanopowder/Nanoparticles, High Purity: 99.995%, Size: 15-45 nm |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Tantalum Carbide (TaC) Micron Powder, Purity: 99.9 %, Size: 3 µm |
| Type 316 Stainless Steel Powder, Purity: 99.9 %, Size: 325 mesh |
| Nitinol Shape Memory Alloy Wire, Diameter: 1 mm, AF: 45-50°C |
| Titanium Dioxide (TiO2) Micron Powder, Purity: 99.5+ %, Size: 1 µm, White, Rutile |
| Calcium Oxide (CaO) Micron Powder, Purity: 99.9 %, Size: 1µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 15-45 µm |
| Boron Nitride (BN) Nanopowder/Nanoparticles, Purity: 99.85+%, Size: 65-75 nm, Hexagonal |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 97+%, Size: 45-65 nm, Oxygen Content: < 3% |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, High Purity: 99.55%, Size: 28-48 nm |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| Multi Walled Carbon Nanotubes, Purity: 92%, Outside Diameter: 8-10 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 7-16 nm |
| Aqueous Suspension of Nanocrystalline Cellulose (NCC), 6%wt |
| Highly Conductive Expanded Graphite Micron Powder, Purity: ≥ 96%, Size: 20 µm |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Manganese Oxide (Mn2O3) Nanopowder/Nanoparticles, Purity: 99.4%, Size: 28 nm |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 99+%, Size : < 70 nm, Laser Synthesized |
| Aluminum Sulfate Octadecahydrate (Al2H36O30S3), Purity: > 99% |
| Cadmium Selenide (CdSe) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: <100 nm |
| Graphite (C) Nanopowder/Nanoparticles, Purity: 99.9 %, Size: < 50 nm |
| Boron (B) Nanopowder/Nanoparticles , APS:100 nm, Purity:99.55+% |
| Niobium Carbide (NbC) Micron Powder, Purity: 99.95%, Size: 1-3 µm |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 97+%, Size: 35-55 nm, Oxygen Content: < 3% |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Coated with Aluminic Ester, Alpha, Size: 55 nm, Super Hydrophobic, Al2O3: Aluminic Ester=98.1:1.2 |
| Double Walled Carbon Nanotubes, Purity: > 65% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile Si Oil, Size: 25 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile, High Purity: 99.5+ %, Size: 28 nm |
| Titanium Carbide (TiC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 790 nm, Cubic |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 45 nm |
| Zirconium Carbide (ZrC) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 400-1100 nm, Cubic |
| Silicon Carbide (SiC) Micron Powder, Beta, Purity: 99.5+%, Size: < 2,6 µm, Whisker |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 18 nm |
| Nickel Tabs, Width: 3 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile Al, Si, Stearic Acid, Size: 25 nm |
| Indium Tin Oxide (ITO) Nanopowder/Nanoparticles, 90:10, Purity: 99.99%, Size: 18-65 nm |
| High Capacity and High Purity Graphite Micron Powder for Li-ion Battery |
| Antimony (Sb) Micron Powder, Purity: 99.99 %, Size: 200 mesh |
| Manganese Sulfate Monohydrate (MnSO4.H2O), Purity: > 99% |
| Tungsten (W) Micron Powder, Purity: 99.95%, Size: Sub-Micron |
| Magnesium (Mg) Micron Powder, Purity: 99.95%, Size: 35 µm, Metal Basis |
| Expandable Graphite, Purity: 95-97%, Size: 50 mesh |
| Tungsten (W) Micron Powder, Purity: 99.95 %, Size: 5 µm |
| Titanium (Ti) Micron Powder, Purity: 99.5+ %, Size: 100 mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: 200 mesh, Fused |
| Europium (Eu) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 30-50 nm |
| Lithium hydroxide monohydrate (Trace Metals basis, LiOH.H2O), Purity: 99.995% |
| Molybdenum (Mo) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Molybdenum (Mo) Micron Powder, Purity: 99.95 %, Size: 325 mesh |
| Aligned Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm, Length 25-95 µm |
| Bismuth Oxide (Bi2O3) Micron Powder, Purity: 99.99%, Size: 1-5 µm |
| Carbon Nanotubes Doped with 32 wt% Graphene Nanopowder/Nanoparticles |
| Carbon Black Powder, Purity: 99.99 %, Size: 4 µm |
| Bismuth Oxide (Bi2O3) Micron Powder, Purity: 99.99%, Size: 10 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1-2 µm, Fused |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, Purity: 99.5+ %, Size: 20-30 nm |
| Graphene Oxide Dispersion, 8 mg/mL, in H2O |
| Nitinol Shape Memory Alloy Wire, Diameter: 0,5 mm, AF: -10 – -15°C |
| Cobalt Iron Oxide (CoFe2O4) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 30 nm |
| Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-28 nm |
| 304SS Coin Cell Conical Spring for CR2032, Diameter: 15.4 mm, Height: 1.1 mm, Thickness: 0.25 mm |
| Manganese (II) Carbonate (MnCO3) Nanopowder/Nanoparticles, Purity: 99.5+ %, Size: 50 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Tungsten (W) Micron Powder, Purity: 99.95%, Size: 10 µm |
| Conductive Graphite Powder for Lithium Battery, Purity: 99.9+%, Size: 1-5 µm |
| Cellulose Nanocrystal (Nanocrystalline Cellulose,CNC) |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| CNTs-High Impact Polystyrene Resin Matrix, CNTs: 22 wt%, HIPS: 78 wt% |
| Expandable Graphite, Purity: 99-99.5%, Size: 50 mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: 325 mesh, Fused |
| Carbon Black & Carbon Nanotube Mixed, Purity: >97.5% |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Carbon Nanotubes-based Conductive Additives for Lithium Ion Battery |
| Indium Tin Oxide (ITO) Nanopowder/Nanoparticles, 95:5, Purity: 99.97+%, Size: 18-73 nm |
| Magnesium Carbonate (MgCO3) Nanopowder/Nanoparticles, Purity: 99+%, Size: 10-70 nm |
| Chromium Carbide (Cr3C2) Nanopowder/Nanoparticles, Purity: 99.75+%, Size: 25-125 nm |
| Zinc Cobalt Iron Oxide (Zn0.5Co0.5Fe2O4) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 38 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in Water, Amorphous, Size: 28 nm, 26 wt% |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in Ethylene Glycol, Size: 22 nm, Amorphous, 15 wt% |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in 1, 2-Propanediol, Size: 22 nm, Amorphous, 15 wt% |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 28-48 nm |
| Cuprous Oxide (Cu2O) Micron Powder, Purity: 99.9%, Size: 1 µm |
| Boron (B) Micron Powder, Purity: 99 %, Size: 10 µm, Amorphous |
| Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 1 mg/mL |
| Manganese (Mn) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 570 nm, Metal Basis |
| Copper (Cu) Nanowire, Purity: 99.55%, in Ethanol |
| Tungsten Disulfide (WS2) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 35-75 nm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 22 nm, Partially Passivated |
| Zirconium Carbide (ZrC) Nanopowder/Nanoparticles, Purity: 99.5+%, Thickness: 18 nm, Cubic |
| Magnesium Carbonate (MgCO3) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 8 nm |
| Nickel Tab with Adhesive Polymer Tape as Negative Terminal for Pouch Cell, Width: 4 mm |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: %99.99, Size: 3 nm, 2200 ppm |
| Zirconium Hydride (ZrH4) Nanopowder/Nanoparticles, Purity: 99.5+ %, Size: 20-40 nm |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.250” |
| C-NERGY SUPER C65 Conductive Carbon Black |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 790 nm, Metal Basis |
| Carbon Titanium Nitride (TiNC) Micron Powder, Purity: 99.95%, Size: 1.05-3.05 μm |
| Zirconia-Yttria Nanopowder/Nanoparticles, ZrO2-8Y, Purity: 99.95%, Size: 30 nm |
| Triton X-100 |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 22 nm, Carbon Coated |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size:18 nm, Carbon Coated |
| Silicon Carbide (SiC) Micron Powder, Purity: 98+%, Size: 1-10 μm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1350 W/m.K, Thickness: 40 µm, Lenght: 115 mm, Width: 90 mm |
| PTFE Inside Chamber for Hydrothermal Synthesis Autoclave Reactors, Volume:50,100,500 ml |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Water, Gamma, Size: 8 nm, 22 wt% |
| 304SS Coin Cell Battery Spacer, Diameter: 15.8 mm, Thickness: 0.5 mm |
| Polytetrafluoroethylene (PTFE) Condensed Liquid Binder for Li-ion Battery |
| Molybdenum (Mo) Micron Powder, Purity: 99.95 %, Size: 3 µm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile, High Purity: 99.5+ %, Size: 490 nm |
| Molybdenum Carbide (Mo2C) Micron Powder, Purity: 99.95%, Size: 2.6 µm, Hexagonal |
| Zinc Carbonate (ZnCO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm |
| Molybdenum (Mo) Micron Powder, Purity: 99.99 %, Size: 1 µm |
| 316 Stainless Steel Wave Spring (Belleville Washers) for CR2032, Diameter: 15.8 mm, Thickness: 0.5 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase/Rutile, Purity: 99.5+%, Size: 18 nm |
| Cobalt Aluminate Blue Spinel Nanopowder CoAl2O4 Size: 300-500 nm |
| Nickel Foam for Battery Applications Size: 200 mm x 300 mm x 0.5 mm |
| Indium Hydroxide (In(OH)3) Nanopowder/Nanoparticles, High Purity: 99.996%, Size: 15-65 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, Purity: 99.5+ %, Size: 17 nm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1700 W/m.K, Thickness: 25 µm, Lenght: 180 mm, Width: 115 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in 1, 2-Propanediol, Size: 12 nm, Anatase, 22 wt% |
| Stellite 6 Spherical Micron Powder, Size : 15-45μm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1600 W/m.K, Thickness: 25 µm, Lenght: 180 mm, Width: 115 mm |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 48-78 nm |
| Cerium Oxide (CeO2) Nanopowder/Nanoparticles Water Dispersion, Size: 25-45 nm, 42 wt% |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 18-28 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile, High Purity: 99.5+ %, Size: 45 nm |
| Silicon Carbide (SiC) Micron Powder, Beta, Purity: 99.5+%, Size: 1.5-35 µm, D50 |
| Erbium (Er) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Cerium Oxide (CeO2) Nanopowder/Nanoparticles, Purity: 99.975%, Size: 8-28 nm |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| (-OH) Functionalized Single Walled Carbon Nanotubes, Purity: > 65% |
| Nickel Hydroxide Ni(OH)2 (NiOH-Co) Micron Powder, Size: 10-15 µm, Spherical |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles Ethanol Dispersion, Size: 45 nm, 22 wt% |
| Nitinol Shape Memory Alloy Wire, Diameter: 1,5 mm, AF: 35-40°C |
| Terbium (Tb) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Carbon Nanotubes Doped with 52 wt% Boron Nitride (BN) Nanopowder/Nanoparticles |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 8-18 nm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 4-16 nm |
| Lithium Nickel Manganese Cobalt Oxide (LiNiCoMnO2) Powder for High Power Li-ion Battery Cathode Application, (Ni:Mn:Co=5:3:2) NMC 532 |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 80-240 nm, Metal Basis |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Graphite Fluoride (Carbon Monofluoride) Micron Powder, 10-20 micron, F/C Ratio : 1.0 |
| Silicon Nitride (Si3N4) Nanopowder/Nanoparticles, Beta, Purity: 99.6%, Size: 760 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Nickel Cobalt Iron Oxide (Ni0.5Co0.5Fe2O4) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 35 nm |
| Tin (Sn) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 50-70 nm, Metal Basis |
| Zinc (Zn) Nanopowder/Nanoparticles, High purity: 99.995+%, Size: 90-110 nm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 18-28 nm |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 50-150 µm, Spherical |
| Graphite Sheet Thermal Interface Material, EYG Series, 1300 W/m.K, Thickness: 50 µm, Lenght: 115 mm, Width: 90 mm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 10-25 µm |
| Carbon Nanotubes Doped with 52 wt% Graphene Nanopowder/Nanoparticles |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Zinc Manganese Iron Oxide (Zn0.5Mn0.5Fe2O4) Nanopowder/Nanoparticles, Purity: 99.995%, Size:28-58 nm |
| Carboxymethyl Cellulose (CMC) Micron Powder for Li-ion Battery Anode Materials |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 48-78 nm |
| Carbon Nanotubes Thermal Radiation Coating Dispersion |
| (-OH) Functionalized Industrial Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-28 nm |
| High Temperature Polyimide Tape for Lithium Battery, Width: 10 mm |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-15 nm |
| (-OH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 48-78 nm |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| (-OH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 18-38 nm |
| Reduced Graphene Oxide (rGO),Purity: 99%, S.A: 15.62 m2/g, 2-5 layers |
| Graphene Ethanol Dispersion, Purity: 99.5%, Graphene: 0.5 wt% |
| Tungsten Oxide (WO3) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 20-60 nm, Orthorhombic |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 65 nm, Metal Basis |
| Titanium Nitride (TiN) Nanopowder/Nanoparticles, Purity: 99.3+%, Size: 790 nm, Cubic |
| (-COOH) Functionalized Single Walled Carbon Nanotubes, Purity: > 65% |
| Silicon Monoxide (SiO) Pellets, Purity: 99.99%, Size: 1-3 mm |
| Erbium Oxide (Er2O3) Micron Powder, Purity: 99.99%, Size: 1-10 µm |
| Zinc Titanate Micron Powder (ZnTiO3) Purity: 99+%, Size: 1-2 µm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, High Purity: 99.5+ %, Size: 10-20 nm |
| Conductive Carbon Black Nanopowder/Nanoparticles, Size: 30 nm |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 8-18 nm |
| Aluminum (Al) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Zirconium Diboride (ZrB2) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 45 nm, Hexagonal |
| Praseodymium Oxide (Pr6O11) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Carbon Aluminum Nitride (AlNC) Micron Powder, Purity: 99.95%, Size: 1-3 µm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 28-48 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Water, Gamma, Size: 28 nm, 22 wt% |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in Water, Amorphous, Size: 8-33 nm, 26 wt% |
| Zinc (Zn) Nanopowder/Nanoparticles, High purity: 99.9+%, Size: 60-70 nm |
| CR2025 Coin Cell Cases (Positive and Negative Cases), Materials: 316SS |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 25-50 µm, Spherical |
| Iron (II,III) Oxide (Fe3O4) Nanopowder/Nanoparticles Water Dispersion, Size: 13-18 nm, 22 wt% |
| Lithium Zirconate (Lithium Zirconium Oxide, Li2ZrO3), Purity: ≥99, Size: 1 -3 µm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 25-45 nm, 42 wt% |
| 316SS Coin Cell Battery Spacer, Diameter: 15.8 mm, Thickness: 0.5 mm |
| Graphite Fluoride (Carbon Monofluoride) Micron Powder for Li-ion Battery, 10-20 micron, F/C Ratio : 0.8-1.0 |
| Thulium Oxide (Tm2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in 1, 2-Propanediol, Size: 12 nm, Gamma, 18 wt% |
| Lithium Iron Phosphate (LiFePO4) Powder for Li-ion Battery Cathode Application |
| Indium Oxide (In2O3) Nanopowder/Nanoparticles, High Purity: 99.9%, Size: 18-68 nm |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 90%, Outside Diameter: 50-80 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Ethylene Glycol, Size: 12 nm, Gamma, 18 wt% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 3-28 nm, 16 wt% |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 1 µm |
| Short Single Walled Carbon Nanotubes, Purity: > 65%, SSA: 400 m2/g |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 60-70 nm, Metal Basis |
| Lanthanum Trifluoride (LaF3) Nanopowder/Nanoparticles, Highly Dispersible, Purity: 99+%, Size: 30-50 nm |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 48-78 nm |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 90-100 nm, Metal Basis |
| Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 48-78 nm |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 4-16 nm |
| Silicon Nitride (Si3N4) Nanopowder/Nanoparticles, Amorphous, Purity: 99.5%, Size: 20-35 nm |
| Erbium Oxide (Er2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5+%, Size: < 70 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Rutile, Size: 4-28 nm, 17 wt% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Rutile, Size: 25-45 nm, 22 wt% |
| Cellulose Nanofiber (Cellulose Nanofibril, Nanofibrillated Cellulose, CNFs) |
| Conductive Carbon Black Nanopowder/Nanoparticles, Size: 20 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, Size: ≤10nm |
| 316SS Coin Cell Conical Spring for CR2032, Diameter: 15.4 mm, Height: 1.2 mm, Thickness: 0.25 mm |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 110 nm, Metal Basis |
| Dysprosium Oxide (Dy2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Neodymium Oxide (Nd2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Manganese (II) Acetate Tetrahydrate (C4H16MnO8), Purity: > 99% |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 18-28 nm |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 28-48 nm |
| Ytterbium (Yb) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: ≥99.9%, Size: 68 nm, Metal Basis |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 14 nm, 1200 ppm |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 28-48 nm |
| Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 1,0 wt% |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99 %, Outside Diameter: 48-78 nm |
| Lithium Nickel Manganese Oxide (LMNO) for Li-Ion Cathode Material, LiNi0.5Mn1.5O4 |
| Zirconium Nitride (ZrN) Micron Powder, Purity: 99.97%, Thickness: 3.5 μm, Cubic |
| Cadmium Sulfide (CdS) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 20 nm |
| Dummy CZ-Si Wafer, Size: 8”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 1000 (ohm.cm), 1-Side Polished, Thickness: 725 ± 50 μm |
| Cuprous Oxide (Cu2O) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 16 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Rutile, Size: 3-13 nm, 16 wt% |
| Aluminum Chloride Hexahydrate (AlCl3H12O6), Purity: > 97% |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 4-16 nm |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 15-35 µm, Spherical |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Water Dispersion, Gamma, Size: 100-200 nm, 23wt% |
| Terbium Oxide (Tb4O7) Nanopowder/Nanoparticles, Purity: 99.97%, Size: 8-110 nm, Cubic |
| Conductive Acetylene Black for Li-ion Battery Anode/Cathode |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| ZK60 Magnesium Alloy Micron Powder, Size Range: 20-63 µm, Spherical |
| High Temperature Teflon Tape for Lithium Battery, Width: 19 mm, Thickness: 0.13 mm, Length: 10 m |
| Graphene NMP Dispersion, Purity: 99.5%, Graphene: 1,0 wt% |
| (-OH) Functionalized Double Walled Carbon Nanotubes, Purity: > 65% |
| Graphene Ethanol Dispersion, Purity: 99.5%, Graphene: 1 wt% |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Graphene Sheet, Size: 29 cm x 29 cm, Thickness: 35 µm, Highly Conductive |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Manganese (Mn) Micron Powder, Purity: 99.99 %, Size: 100 mesh |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Lithium (Li) Foil Thickness:0.5 mm, Width: 50 mm, Length: 100 mm, Purity: 99.9% |
| Yttrium Aluminate (Y3Al5O12) Nanopowder/Nanoparticles, Purity: 99.7+%, Size: 25 nm |
| Silver (Ag) Nanopowder/Nanoparticles Water Dispersion, Size: 2 nm, Colorless & Transparent, 2.200 ppm |
| Water.webp |
| Water Soluble Carbon Quantum Dots 590-620 nm |
| Boron (B) Micron Powder, Purity: 95+%, Size: 1-2 μm Amorphous |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Titanium (Ti) Micron Powder, Purity:99.5+%, Size:75-150 µm, Spherical |
| G-QD.webp |
| Graphene Quantum Dots (1mg/ml) (GQD) |
| Barium Iron Oxide (BaFe12O19) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 55 nm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Hafnium Oxide (HfO2) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 18-28 nm |
| (-COOH) Functionalized Industrial Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 28-48 nm |
| Titanium Alloy Micron Powders, CPTi, 50-150 µm, Spherical |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Copper Nickel (Cu-Ni) Alloy Nanopowder/Nanoparticles, Size: < 80 nm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Zirconium Diboride (ZrB2) Micron Powder, Purity: 99.5%, Size: 5.5 μm, Hexagonal |
| Nickel (Ni) Micron Powder, Purity: 99.95 %, Size: 4 µm, Spherical |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 2”, Thickness: 0.125” |
| Cadmium Sulfide (CdS) Nanopowder/Nanoparticles, Purity: 99.95+%, Size: 5 nm |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| High Purity Natural Graphite Nanopowder/Nanoparticles for Li-ion Battery, Purity: 99.99+%, Size: 30 nm |
| Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 2 mg/mL |
| Iron (Fe) Micron Powder, Purity: 99.99 %, Size: 5 µm |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 10-25 µm, Spherical |
| Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 1 µm, Spherical |
| Industrial Grade Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 28-48 nm |
| Titanium Alloy Micron Powders, CPTi, 25-50 µm, Spherical |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 25-45 nm, 16 wt% |
| Aluminum chloride (AlCl3) Purity: > 99% |
| Cuprous Oxide (Cu2O) Micron Powder, Purity: 99.99 %, Size: 3 µm |
| Vanadium Carbide (VC) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 550-750 nm, Cubic |
| Lead (Pb) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Multi Walled Carbon Nanotubes Water Dispersion, 4 wt%, Purity: > 96%, OD: 18-28 nm, Length: 8-35 µm |
| Boron (B) Micron Powder, Purity: 95+ %, Size: -325 mesh, Amorphous |
| Lithium Nickel Manganese Cobalt Oxide (LiNiMnCoC) Powder (NMC 622) |
| Lithium Nickel Manganese Cobalt Oxide Powder (NMC 811) |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Aluminum Foam for Battery and Supercapacitor Research, Purity: 99+%, Size : 100 mm x100 mm x 4mm |
| Titanium Alloy Micron Powders, CPTi, 15-35 µm, Spherical |
| Lithium Nickel Manganese Cobalt Oxide (LiNiMnCoC) Powder (NMC 111) |
| Nickel (III) Oxide (Ni2O3) Nanopowder/Nanoparticles, Purity: 99.95+ %, Size: 40 nm |
| (-OH) Functionalized Industrial Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 28-48 nm |
| Tungsten (W) Micron Powder, Purity: 99.95%, Size: 325 mesh |
| Highly Conductive Expanded Graphite Micron Powder, Purity: ≥ 96%, Size: 70 µm |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 8-18 nm |
| Manganese (II) Chloride (MnCl₂), Purity: > 99% |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Helical Multi Walled Carbon Nanotubes, Outside Diameter: 75-175 nm, Length: 2-15 µm |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 4-16 nm |
| Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.955+%, Size: 65 nm, Metal Basis |
| Multi Walled Carbon Nanotubes N-Methyl-2-Pyrrolidinone Dispersion, 4 wt%, Purity: > 96 %, OD: 18-28 nm, Length 8-18 µm |
| Iron (III) Chloride (FeCl3), Purity: > 99% |
| Carbon Nanotubes Metal Tapes with Iron (Fe) 14 wt%, Thickness: 18 µm, Dia: 47 mm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 22 nm, Carbon Coated |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Graphene Oxide, 2-5 Layer, Dia: 4,5 µm, SA: 420 m2/gr |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Copper Oxide (CuO) Nanopowder/Nanoparticles Water Dispersion, Size: 20-50 nm, 22 wt% |
| Zinc Sulfide (ZnS) Pellets, Purity: 99.99%, Size: 1-10 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 3-12 nm, 16 wt% |
| (-OH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 7-16 nm |
| Graphitic Carbon Nitride (g-C3N4) Powder 1-10 μm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3” , Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotube-Mica Prepared by Electrostatic Adsorption, CNTs: 15 wt%; Mica: 85 wt% |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Silver Tin (Ag-Sn) Alloy Nanopowder/Nanoparticles, Purity: 99.95%, Size : < 110 nm |
| Carbon Nanotube-TiO2 Prepared by Electrostatic Adsorption, CNTs: 15 wt%, TiO2-rutile: 85 wt% |
| Copper Foam for Battery and Supercapacitor Research, Purity: 99.9+%, Size : 100 mm x100 mm x 1mm |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 100 mesh |
| Graphene Ethanol Dispersion, Purity: 99.5%, Graphene: 2 wt% |
| Cobalt Titanate Green Spinel Nanopowder ( Co2TiO4) |
| Titanium Oxynitride Nanoparticle, APS: 20 nm, Purity: 99.9% |
| Europium Oxide (Eu2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Lithium Nickel Cobalt Aluminum Oxide (NCA) (LiNi0.8Co0.15Al0.05O2) Powder for High Power Li-ion Battery Cathode Application |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5+%, Size: 50-70 nm |
| Silver Copper (Ag-Cu) Alloy Nanopowder/Nanoparticles, Purity: 99.95% , Size: < 110 nm |
| Tungsten Carbide (WC) Nanopowder/Nanoparticles, Purity: 99.96%, Size: 25-95 nm |
| Iron Foam for Battery and Supercapacitor Research, Purity:98%, Size:300*200mm, Thickness: 2mm |
| PVDF Binder for Li-ion Battery Electrodes (set: 80g ) |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 10 µm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Lead Oxide (PbO) Micron Powder, Purity: 99.99 %, Size: 325 mesh, Yellow |
| Multi Walled Carbon Nanotubes Water Dispersion, 4 wt%, Purity: > 96%, OD: 3-13 nm, Length: 45 µm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1300 W/m.K, Thickness: 50 µm, Lenght: 180 mm, Width: 115 mm |
| Titanium Alloy Micron Powders, CPTi, 10-25 µm, Spherical |
| Tungsten Oxide (WO3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Carbon Nanotubes Doped with 52 wt% Copper (Cu) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Tin (Sn) Nanopowder/Nanoparticles |
| Titanium Aluminum Carbide (Ti2AlC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Titanium (Ti) Micron Powder, Purity:99.5+%, Size:15-53 µm, Spherical |
| Super Conductive Carbon Black Nanopowder and Carbon Nanotube Mixed |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Graphitized Carbon Nanofiber, Purity: 99.95%, Size: 200-600 nm |
| Cesium Tungsten Oxide (Cs0.33WO3) Nanopowder/Nanoparticles, Purity: 99+%, Size: 18 nm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Cuprous Oxide (Cu2O) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 80 nm |
| Tantalum Pentoxide (Ta2O5) Micron Powder, Purity: 99.9 %, Size: 3 µm, White |
| Titanium (Ti) Micron Powder, Purity:99.5+%, Size:5-25 µm, Spherical |
| SS316 Coin Cell Battery Spacer, Diameter: 15.8mm, Thickness: 1mm |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 52 wt% Silica (SiO2) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Iron Oxide (Fe3O4) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Zinc (Zn) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Titanium (Ti) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Cobalt (Co) Nanopowder/Nanoparticles |
| Gold (Au) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 20-30 nm, 172 ppm |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Chromium Nitride (CrN) Micron Powder, Purity: 99.99%, Size: 1-3 µm |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Cobalt Oxide (CoO) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Graphite Sheet Thermal Interface Material, EYG Series, 1600 W/m.K, Thickness: 25 µm, Lenght: 230 mm, Width: 180 mm |
| Boron (B) Micron Powder, Purity: 95+%, Size: < 1 µm, Amorphous |
| (-COOH) Functionalized Short Single Walled Carbon Nanotubes, Purity: > 65% |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 4”, Thickness: 0.250” |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Single Walled Carbon Nanotubes, Purity: > 92%, OD: 1-2 nm |
| Nickel Oxide (NiO) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18 nm, Cubic |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Dispersion in PGMEA or PGME, Size: 1 µm, Rutile, 20 wt% |
| Carbon Nanotubes Doped with 52 wt% Alumina (Al2O3) Nanopowder/Nanoparticles |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile: 90 wt%, CNTs: 8 wt% |
| Lithium (Li) Foil Thickness:0.6 mm, Width: 25 mm, Length: 100 mm, Purity: 99.9% |
| Carbon Nanotubes Doped with 52 wt% Aluminum (Al) Nanopowder/Nanoparticles |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Titanium Aluminum Carbide (Ti3AlC2) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Nitrogen-doped Multi Walled Carbon Nanotubes |
| Nickel Chromium (Ni-Cr) Alloy Nanopowder/Nanoparticles, Purity: 99.95%, Size: < 90 nm |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 2 wt% |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Hexaboride (LaB6) Micron Powder, High Purity: 99.95+%, Size: 200 mesh |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Nickel (Ni) Micron Powder Type 255, Purity: >99.7 %, APS: 2.2–2.8 μm |
| Carbon Nanotubes Doped with 12 wt% Iron (Fe) Nanopowder/Nanoparticles |
| Beryllium (Be) Micron Powder, Purity: 99.5+%, Size: -100 mesh |
| Magnesium Nitride (Mg3N2) Micron Powder, Purity: 99.95%, Size: 35 µm |
| Tin Oxide (SnO2) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18 nm |
| Hafnium Carbide (HfC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 790 nm, Cubic |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 32 wt% Silicon (Si) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 32 wt% Copper (Cu) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 32 wt% Iron (Fe) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 12 wt% Copper (Cu) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Silicon (Si) Nanopowder/Nanoparticles |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 2” , Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Niobium (Nb) Micron Powder, Purity: 99.95 %, Size: 3 µm |
| Cadmium Selenide (CdSe) Micron Powder, Purity: 99.9+%, Size: 1-10 µm |
| Carbon Nanotubes Doped with 52 wt% Iron (Fe) Nanopowder/Nanoparticles |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 1”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 32 wt% Silicon (Si) and 32 wt% Graphene Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 12 wt% Aluminum (Al) Nanopowder/Nanoparticles |
| Dysprosium (Dy) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 1”, Thickness: 0.125” |
| Graphene NMP Dispersion, Purity: 99.5%, Graphene: 2,0 wt% |
| Carbon Nanotubes Doped with 32 wt% Aluminum (Al) Nanopowder/Nanoparticles |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 1”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Aluminum Zirconium Alloy Powder, Purity: 99.9+%, Size: < 44 µm, Al: 90%, Zr: 10% |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| SS304 Coin Cell Battery Spacer, Diameter: 15.8mm, Thickness: 1mm |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 1”, Thickness: 0.250” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Silicon (Si) Nanopowder for Battery Applications |
| Yttrium Oxyfluoride (YOF) Nanopowder, Purity: 99.9%, APS: < 50 nm |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Yttrium Fluoride (YF3) Nanopowder, Purity: 99.9%, APS: < 50 nm |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size:1”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| (-OH) Functionalized Single Walled Carbon Nanotubes, Purity: > 92%, SSA: 370 m2/g, Dia: 1.0 nm |
| (-COOH) Functionalized Single Walled Carbon Nanotubes, Purity: > 92%, SSA: 370 m2/g |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| PPL Inside Chamber for Hydrothermal Synthesis Autoclave Reactors |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Water-_21_.webp |
| Diamond (C) Nanopowder/Nanoparticles, Purity: 99%, Size: 30-50 nm |
| Lanthanum Hexaboride (LaB6) Micron Powder, High Purity: 99.5+%, Size: 1.5-18 µm |
| Crystalline Boron (B) Micron Powder, Average Particle Size: -325 Mesh, Purity: 99+% |
| Aluminum 2024 Alloy Powder, Size: – 325 mesh |
| Aluminum 6061 Alloy Powder, Size: 15-53 µm, Spherical |
| N-Methyl-2-Pyrrolidone (NMP) Solvent for Lithium Battery Cathode Materials, Purity: 99.90% |
| Carbon Nanotube-Polystyrene Microspheres Prepared by Electrostatic Adsorption, CNTs: 25 wt%; Polystyrene Microspheres: 75 wt% |
| Niobium (Nb) Micron Powder, Purity: 99.95%, Size: 325 mesh |
| Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 100 mesh, Spherical |
| Hafnium (Hf) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| View Product |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in 2-Propanol, Size: 12 nm, Anatase, 22 wt% |
| Cobalt Chromium (Co-Cr) Alloy Powder, Size: < 44 µm, Co: 20%, Cr: 80% |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Ni-Ti50 Alloy Powder / Solid Spherical Micron Powder, Purity: 99.9%, APS: 45-105 μm |
| WE43 Magnesium Alloy Average Particle Size: 15-53 um, Spherical |
| Zirconium (Zr) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Crystalline Boron (B) Micron Powder, Average Particle Size: 5 µm, Purity: 99+% |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Lithium Lanthanum Tantalum Zirconate (LLZTO), Size: 1-3 µm, Purity: ≥99.5 |
| Graphite Sheet Thermal Interface Material, EYG Series, 1300 W/m.K, Thickness: 50 µm, Lenght: 230 mm, Width: 180 mm |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 31 nm, Metal Basis |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 90 nm, Metal Basis |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 52 wt% Silver (Ag) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 12 wt% Silver (Ag) Nanopowder/Nanoparticles |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 3”, Thickness: 0.125” |
| Copper Indium (Cu-In) Alloy Nanopowder/Nanoparticles, Purity: 99.9% , Size: < 500 nm |
| Aluminum Nitride (AlN) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 790 nm, Hexagonal |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Carbon Nanotube-TiO2 Prepared by Electrostatic Adsorption, CNTs: 25 wt%, TiO2-rutile: 75 wt% |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 32 wt% Silver (Ag) Nanopowder/Nanoparticles |
| Molybdenum (Mo) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 50-150 nm, Metal Basis |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.125” |
| Lead Zirconate Titanate (PZT) Nanopowder/Nanoparticles, Purity: 99.5+ %, Size: < 100 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 3”, Thickness: 0.250” |
| Crystalline Boron (B) Micron Powder, Average Particle Size: 1 µm, Purity: 99+% |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 279 ± 20 μm |
| Scandium (Sc) Micron Powder, Purity: 99.9 %, Particle Size: 200 mesh |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Vanadium Aluminum Carbide (V2AlC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.250” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 1”, Thickness: 0.250” |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 65 nm, Metal Basis |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Amino-Multi Walled Carbon Nanotubes, Purity: > 95 wt%, Length: 60 μm |
| Carbon Nanotube Sponges, Size: 10 mm x 10 mm, Thickness: 1-2 mm |
| Scandium (Sc) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Carbon Nanotubes Metal Films with Iron (Fe) 13 wt%, Thickness: 18 µm, Diameter: 47 mm |
| Titanium Tin Carbide (Ti2SnC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Niobium Aluminum Carbide (Nb2AlC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Bismuth (III) Sulfide (Bi2S3) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 500 nm |
| Hydrothermal Synthesis Autoclave Reactor with PTFE Lined Vessel 50 ml |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Indium Oxide (In2O3) Micron Powder, Purity: 99.99 %, Size: 325 mesh, White |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 625±25um |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Boron Doped, Resistivity: 1-20 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.995%, Size: 1”, Thickness: 0.250” |
| Titanium Foam for Battery and Supercapacitor Research, Purity: 99+%, Size: 100 mm x100 mm x 2.8mm |
| Carbon Nanotube Sponges, Size: 10 mm x 10 mm, Thickness: 3-4 mm |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Styrene-Butadiene Rubber (SBR) Binder for Li-ion Battery Anode Materials |
| Carbon Nanotube-Carbon Black Prepared by Electrostatic Adsorption, CNTs: 34.4 wt%, Carbon Black: 65.6 wt% |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Cubic Boron Nitride Nanopowder, Cubic, Size: <250 nm Purity: 99.5% |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 280 ± 15 μm |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Borosilicate Wafer, Size: 3”, 2-Side polished, Thickness: 500 ± 25 μm |
| Carbon Nanotube Buckypaper with Metal 0.8%, Thickness: 28 µm, Diameter: 35-39 mm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Copper-Zinc Alloy Nanopowder, Cu55Zn45, Average Particle Size: 50nm, Purity: 99.9% |
| Lithium Battery Strapping Tape, Width: 10 mm, Thickness: 0.03 mm, Length: 100 m |
| Iron-Silicon Nanoparticles, Fe65Si35, APS:50nm, Purity: 99.9% |
| Iron-Nickel Nanoparticles, Fe65Ni35, APS: 50nm, Purity: 99.9% |
| Copper Nickel Alloy Nanopowder, Cu55Ni45, APS: 50nm, Purity: 99.9% |
| Aluminum-Silicon (AlSi) Alloy Powder, Al85Si15, APS: 50nm, Purity: 99.9% |
| Silver Indium (Ag-In) Alloy Nanopowder/Nanoparticles, Purity: 99.9%, Size: 40-100 nm |
| Vanadium Nitrade (VN) Nanopowder, APS: 40nm, Purity: 99.9% |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Dummy CZ-Si Wafer, Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1-50 (ohm.cm), 2-Side Polished, Thickness: 525 ± 25 μm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 280 ± 25 μm |
| Multi Walled Carbon Nanotubes Isopropanol Dispersion, 4 wt%, Purity: >96%, OD: 45-75 nm, Length 8-28 µm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 279 ± 20 μm |
| Multi Walled Carbon Nanotubes N-butanol Dispersion, 4 wt%, Purity: >96%, OD: 45-75 nm, Length 8-28 µm |
| CR2032 Coin Cell Cases with 304SS, Diameter: 20 mm, Height: 3.2 mm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Arsenic Doped, Resistivity: 0,001-,0.005 (ohm.cm), 1-Side Polished, Thickness: 400 ± 25 μm |
| Cobalt (II) Chloride Hexahydrate (Cl2CoH12O6), Purity: > 99% |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 2”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 380 ± 25 μm |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 770 nm, Metal Basis |
| Aluminum Tab for Pouch Li-ion Cell, Width: 4 mm, Length: 57 mm |
| Quartz Wafer, (X-Cut), Size: 2”, 2-Side Polished, Thickness: 500 ± 25 μm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Test CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-20 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Borosilicate Wafer, Size: 3”, 1-Side polished, Thickness: 150 ± 25 μm |
| Dummy CZ-Si Wafer, Size: 3”, Orientation: (111), Phosphor Doped, Resistivity: 0,001-100 (ohm.cm), 1-Side Polished, Thickness: 340 ± 25 μm |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 380±25um |
| Borosilicate Wafer, Size: 4”, 1-Side polished, Thickness: 700 ± 25 μm |
| Carbon Nanotubes Highly Conductive Tapes with Metal 8%, Thickness: 18 µm, Dia: 47 mm |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 12 wt% Silicon (Si) Nanopowder/Nanoparticles |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 2”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Platinum (Pt) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 10 nm, 1100 ppm |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| CR2032 Coin Cell Case (Negative Case, Cone Spring, Spacer, Positive Case) |
| Thulium (III) oxide Micron Powder, Size: 3-5 um, Purity: 99.9 % |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Cubic Boron Nitride Nanopowder, Cubic, Size: <200 nm Purity: 99.9% |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 80 nm, Metal Basis |
| Graphene Oxide Water Dispersion, Purity: 99.5%, Black Liquid, GO: 2,0 wt% |
| Reduced Graphene Oxide Water Dispersion, Purity: 99.5%, rGO: 2,0 wt% |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 625±25um |
| Short Single Walled Carbon Nanotubes, Purity: > 92% |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 2”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Graphite Fluoride (Carbon Monofluoride) Micron Powder, 8-10 micron, F/C Ratio : 1.2 |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Tantalum (Ta) Nanopowder/Nanoparticles, High Purity: 99.9%, Size: 45-75 nm |
| Large Surface Area Single Walled Carbon Nanotubes, Purity: > 95%, SSA: 400 m2/g |
| Prime Si+SiO2 Wafer (dry), Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 279 ± 20 μm, Coating 100 nm |
| (-OH) Functionalized Short Length Double Walled Carbon Nanotubes, Purity: > 65% |
| Lithium Lanthanum Zirconate (LLZO, Li7La3Zr2O12), Purity: ≥99.5, Size: 0.3 -1 µm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (110), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 525 ± 25 μm |
| Dummy CZ-Si Wafer, Size: 6”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 100 (ohm.cm), 1-Side Polished, Thickness: 650 ± 50 μm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Dummy CZ-Si Wafer, Size: 6”, Orientation: (100), Phosphor Doped, Resistivity: 0.001 – 100 (ohm.cm), 1-Side Polished, Thickness: 650 ± 50 μm |
| Borosilicate Wafer, Size: 4”, 1-Side polished, Thickness: 1000 ± 20 μm |
| Platinum Oxide (PtO2) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: <100 nm |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99% Size: 3”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 35 nm, Metal Basis |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Thulium (Tm) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 2”, Thickness: 0.250” |
| Single Layer Graphene Oxide, Purity: 99.5 % |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.125” |
| (-COOH) Functionalized Short Length Double Walled Carbon Nanotubes, Purity: > 65% |
| Antimony (Sb) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| CR2016 Coin Cell Cases with 304SS (Positive+Negative Cases), Diameter: 20 mm, Height : 1.6 mm |
| CR2325 Coin Cell Cases with 304SS (Positive+Negative Cases), Diameter: 23 mm, Height : 2.5 mm |
| Tin (Sn) Micron Powder, Purity: 99.95 %, Size: 3 µm |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 4”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 3”, Thickness: 0.125” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Prime FZ-Si Wafer, Size: 2”, Orientation: (100), Phosphor Doped, Resistivity: 7000 – 8000 (ohm.cm), 2-Side Polished, Thickness: 250 ± 15 μm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 2000 ± 50 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 8-12 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Prime Si+SiO2 Wafer (wet), Size: 2”, Orientation: (111), Boron Doped, Resistivity: 1 -20 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm, Coating 500 nm |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Hydrothermal Synthesis Autoclave Reactor with PPL Lined Vessel 50 ml |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 30-40 nm, Metal Basis |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| (-OH) Functionalized Short Single Walled Carbon Nanotubes, Purity: >92% |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 3”, Thickness: 0.250” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 350± 25 μm, Single Side Polished, EPI-ready, Mobility: 1000-3000 |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Single Side Polished, EPI-ready, Dopant: Zinc (P Type) |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Scandium Oxide (Sc2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 0,01-0,02 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Prime Si+SiO2 Wafer (wet), Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 380 ± 25 μm, Coating 300 nm |
| Prime Si+SiO2 Wafer (dry), Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 380 ± 25 μm, Coating 100 nm |
| Test CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0,001-0,005 (ohm.cm), 2-Side Polished, Thickness: 200 ± 10 μm |
| Dummy CZ-Si Wafer, Size: 6”, Orientation: (100), Boron Doped, Resistivity: 5-10 (ohm.cm), 1-Side Polished, Thickness: 675 ± 25 μm |
| Iron (II) Sulfate (FeSO4.xH2O), Purity: > 98% |
| CR2450 Coin Cell Cases with 304SS (Positive+Negative Cases), Diameter: 24 mm, Height : 5 mm |
| Aluminum 7075 Alloy Powder, Size: 15-53 µm, Spherical |
| Silver Conductive Adhesive Paste |
| Hydrothermal Synthesis Autoclave Reactor with PTFE Lined Vessel 100 ml |
| Magnetic Graphene Aerogel, Content of Fe3O4: 65%, Diameter: 1±0.1 cm |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 1×1 cm |
| Magnetic Graphene Aerogel, Content of Fe3O4: 50%, Diameter: 1±0.1 cm |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 0.005 (ohm.cm), 2- Polished, Thickness: 200 ± 10 μm |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 700 ± 20 μm |
| Hafnium (Hf) Micron Powder, Purity: 99.9+%, Size: 15-53 μm, Spherical |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2- Polished, Thickness: 200 ± 10 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0,01-0,02 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 300 ± 25 μm |
| Graphitized Carbon Nanofibers, Purity: > 99.9%, Outside Diameter: 50-100 nm, Length: 1-15 μm |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 500 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: NG08SW0227 400±25um |
| CR2032 Coin Cell Case (Negative Case, Cone Spring, Spacer, Positive Case), Materials: 316SS |
| Carbon Nanotube (CNT) Nanoribbon |
| Ultralight Graphene Aerogel, Diameter: 1.2±0.1 cm, Height: 1.2±0.1 cm |
| Lithium Cobalt Oxide (LiCoO2) Coated Aluminum Foil |
| Lithium Iron Phosphate (LiFePO4) Coated Aluminum Foil |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Silicon Hexaboride (SiB6) Nanopowder, APS: 40nm, Purity: 99% |
| Carbon-Coated Aluminum Foil |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Strong Graphene Aerogel, Diameter: 1.2±0.1 cm, Height: 1.2±0.1 cm |
| Carbon Nanotubes(CNT) Modified Graphene Aerogel, Diameter: 1.2±0.1cm, Height: 1.2±0.1cm |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 3”, Thickness: 0.250” |
| Prime Si+SiO2 Wafer (wet), Size: 3”, Orientation: (111), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 381 ± 25 μm, Coating 500 nm |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.250” |
| Hydrothermal Synthesis Autoclave Reactor with PPL Lined Vessel 100 ml |
| Nickel Foam for Battery Cathode Substrate, Size: 1000 mm x 300 mm x 1.6 mm |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Large Inner Diameter Thin Multi-Wall Carbon Nanotubes, Purity: > 92%, OD: 28-58 nm, ID: 18-48 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 4”, Thickness: 0.250” |
| Prime Si+SiO2 Wafer (dry), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 200 nm |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 2-Side Polished, Thickness: 500 ± 15 μm, Coating 300 nm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 0.05 – 0.152 (ohm.cm), 2-Side Polished, Thickness: 365 ± 15 μm |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 300 nm |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 400 nm |
| Mesocarbon Microbeads (MCMB) Graphite Micron Powder for Lithium Ion Battery |
| Fused Silica Wafer, Size: 4”, 2-Side Polished, Thickness: 1000 ± 25 μm |
| Fused Silica Wafer, Size: 10mm x 20mm, 2-Side Polished, Thickness: 500 ± 00 μm, |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| (-COOH) Functionalized Short Length Single Walled Carbon Nanotubes, Purity: > 92% |
| CR2032 Coin Cell Cases with 316SS, Diameter: 20 mm, Height: 3.2 mm |
| Prime CZ-Si Wafer, Size: 6”, Orientation: (111), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 625±25um |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 14 nm, 52000 ppm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 5”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Short Length Double Walled Carbon Nanotubes, Purity: > 65% |
| Single Walled Carbon Nanotubes, Purity: > 96%, Dia: 1.0 nm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Carbon Nanotubes Metal Tapes with Copper (Cu) 13 wt%, Thickness: 22 µm, Dia: 47 mm |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Carbon Nanotubes Metal Films with Copper (Cu) 14 wt%, Thickness: 18 µm, Dia: 47 mm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 6”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 500±25um |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Chromium (Cr) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 30-40 nm, Metal Basis |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.250” |
| Magnetic Fe2O3@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Positively-charged |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 6”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525±25um |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Prime Si+SiO2 Wafer (dry), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 100 nm |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125”, Dark Gray to Black |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 500 ± 20 μm |
| Graphite Plate, Purity: 99.99%, D: 100mm x 20mm |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 2000 – 4000 (ohm.cm), 1-Side Polished, Thickness: 300 ± 10 μm |
| Magnetic Fe2O3@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Negatively-charged |
| Magnetic Fe3O4@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Positively-charged |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.125” |
| Platinum Foil, Purity 99.95%, Thickness: 0.5mm, 1×1 cm |
| Magnetic Fe3O4@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Negatively-charged |
| Borosilicate Wafer, Size: 6”, 1-Side polished, Thickness: 700 ± 25 μm |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| 18650 Cylinder Cell Case |
| Platinum Foil, Purity 99.95%, Thickness: 1 mm, 1×1 cm |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| AZ31 Spherical Magnesium Alloy Powder, Size: 15-53 µm, Purity: > 95 % |
| PE Separator Film for Battery Applications Thickness: 12μm, Width: 60mm, Length: 500 m, 1 roll: 500 m |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Titanium (Ti) Nanopowder/Nanoparticles, Purity:99.9+%, Size: 80-120 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 6”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”, White to Gray |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 2”, Thickness: 0.250” |
| CR2016 Coin Cell Cases with 316SS (Positive+Negative Cases), Diameter: 20 mm, Height : 1.6 mm |
| Water-_17_.webp |
| Hafnium Diboride Micron Powder, Purity: 99.5 %, Size: 1-3 μm |
| CR2450 Coin Cell Cases with 316SS (Positive+Negative Cases), Diameter: 24 mm, Height : 5 mm |
| Chromium (Cr) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: 100 nm, Metal Basis |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 200 ± 20 μm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Borosilicate Wafer, Size: 6”, 2-Side polished, Thickness: 700 ± 20 μm |
| CR2325 Coin Cell Cases with 316SS (Positive+Negative Cases), Diameter: 23 mm, Height : 2.5 mm |
| Prime CZ-Si Wafer, Size: 8”, Orientation: (100), Phospor Doped, Resistivity: 0.001-0.005 (ohm.cm), 1-Side Polished, Thickness: 725 ± 20 μm |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”, Grey to Black |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles, Size: 55 nm, Ni:Ti/50:50 |
| (-COOH) Functionalized Double Walled Carbon Nanotubes, Purity: > 65% |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| 18650 Nickel Strip for Battery Tab, Width: 4 mm, Thickness: 0.1 mm, 1 Roll: 1 kg |
| Prime Si+Si3N4 Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 381± 25 μm, Coating 150 nm |
| Carbon Nanotubes Highly Conductive Films, Thickness: 10-20 µm, Dia: 120-130 mm |
| Magnetic Fe2O3@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Positively-charged |
| Magnetic Fe2O3@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Negatively-charged |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 1000 nm |
| Vanadium (V) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Borosilicate Wafer, Size: 6”, 2- Side polished, Thickness: 1100 ± 20 μm |
| Lithium Cobalt Oxide (LiCoO2) Powder for Li-ion Battery Cathode Application |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 380± 15 μm, Coating 150 nm |
| High Quality Natural Agate Mortar and Pestle, Size: 4″ |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Magnetic Fe3O4@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Positively-charged |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 6”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Magnetic Fe3O4@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Negatively-charged |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.125” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 8”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 1500 nm |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.125” |
| Magnetic Graphene Aerogel, Content of Fe3O4: 65%, Diameter: 2±0.4 cm |
| Magnetic Graphene Aerogel, Content of Fe3O4: 50%, Diameter: 2±0.4 cm |
| Lutetium Oxide (Lu2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Magnetic Fe2O3@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Positively-charged |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Ultralight Graphene Aerogel, Diameter: 2±0.4 cm, Height: 2±0.4 cm |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Aluminum Foil for Battery Cathode Substrate, Size: 350 m*280 mm*15 µm |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Graphene Sample Pack (Includes 9 products) |
| Magnetic Fe3O4@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Positively-charged |
| Magnetic Fe2O3@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Negatively-charged |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 0.01 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 500 nm |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250”, Dark Gray to Black |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Titanium (Ti) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 30-80 nm |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Magnetic Fe3O4@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Negatively-charged |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 525± 25 μm, Coating 70 nm |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Multi Walled Carbon Nanotubes N-butanol Dispersion, 4 wt%, Purity: > 96%, OD: 18-28 nm, Length: 8-18 µm |
| Carbon Nanotubes(CNT) Modified Graphene Aerogel, Diameter: 2±0.4 cm, Height: 2±0.4 cm |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 35-55 nm, Metal Basis |
| Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Sn:Cu/92:8 |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Sn:Cu/1:9 |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 5”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 4”, Thickness: 0.125” |
| Multi Walled Carbon Nanotubes Ethanol Dispersion, 4 wt%, Purity: > 96 %, OD: 45-75 nm,Length 8-28 µm |
| Magnetic Fe2O3@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Positively-charged |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 525± 25 μm, Coating 150 nm |
| Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”, Grey to Black |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”, White to Gray |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 97+%, Size: 25-35 nm, Oxygen Content: < 3% |
| Magnetic Fe3O4@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Positively-charged |
| Ãrün-Görselleri-_6_.webp |
| Holey Super Graphene |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Magnetic Fe2O3@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Negatively-charged |
| Cobalt Acetate (C4H6CoO4), Purity: > 98% |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Magnetic Fe3O4@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Negatively-charged |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 3”, Thickness: 0.125” |
| Gadolinium (Gd) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Fused Silica Wafer, Size: 4”, 2-Side Polished, Thickness: 500 ± 25 μm |
| Fused Silica Wafer, Size: 6”, 2-Side Polished, Thickness: 700 ± 25 μm |
| Prime Si+Si3N4 Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 381± 25 μm, Coating 300 nm |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (111), None Doped, Resistivity: 10000 – 100000 (ohm.cm), 2-Side Polished, Thickness: 300 ± 20 μm |
| Carbon Nanotube Fibres, Fiber diameter: 60-80 µm, Tensile Strength: 310-500 MPa, Electrical conductivity: 1×10^5~2×10^5 S/m |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Iron Nickel Cobalt (Fe-Ni-Co) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Fe:Ni:Co/55:28:17 |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 2×2 cm |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 3”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Molybdenum Aluminum Boride (MoAlB) Max Phase Powder, Purity: 99+%, Size: 200 mesh |
| Magnetic Fe2O3@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Positively-charged |
| Prime Si+SiO2 Wafer (dry), Size: 6”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 2-Side Polished, Thickness: 675 ± 15 μm, Coating 200 nm |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), None Doped, Resistivity: 1000 – 10000 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Strong Graphene Aerogel, Diameter: 2±0.4 cm, Height: 2±0.4 cm |
| Vanadium (V) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Flash-Ignited Multi-Walled Carbon Nanotubes, MWCNTs: 48 wt%, Fe Nanoparticles: 23 wt%, Amorphous Carbon: 23 wt% |
| Aluminum Laminated Film, Width: 400 mm, Length: 7.5 m |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Magnetic Fe2O3@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Negatively-charged |
| Nickel(II) Nitrate Hexahydrate (Ni(NO₃)₂*6H₂O), Purity: > 98% |
| Silver (Ag) Nanopowder/Nanoparticles Water Dispersion, Size: 15 nm, Tawny Color, 55.000 ppm |
| Magnetic Fe3O4@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Negatively-charged |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 4”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in 2-Propanol, Gamma, Size: 12 nm, 12 wt% |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 3000 – 100000 (ohm.cm), 2-Side Polished, Thickness: 200 ± 10 μm |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 5000 – 500000 (ohm.cm), 2-Side Polished, Thickness: 300 ± 10 μm |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Boron Oxide (B2O3) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: 50 nm |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 80 ppm Dry powder |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Hand-Held Disc Cutter with Ring Cutting Dies, ID: 8,15,18,20 mm |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Aluminum Nickel Composite Strip for Battery Tab, Width: 4 mm, Thickness: 0.1 mm, 1Roll: 1 kg |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Cobalt (Co) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 28 nm, Carbon Coated |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Arsenic Doped, Resistivity: 0,001-0,005 (ohm.cm), 1 Side Polished, Thickness: 525± 25 μm, Coating 450 nm |
| Prime FZ-Si Wafer, Size: 3”, Orientation: (100), None Doped, Resistivity: 10000 – 100000 (ohm.cm), 2-Side Polished, Thickness: 380 ± 25 μm |
| Multi Walled Carbon Nanotubes Ethanol Dispersion, 3 wt%, Purity: > 95%, OD: 18-28 nm, Length: 8-28 µm |
| Selenium (Se) Sputtering Targets, elastomer, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Carbon Nanotubes Highly Conductive Films with Metal 8%, Thickness: 18 µm, Dia: 47 mm |
| Multi Walled Carbon Nanotubes N-butanol Dispersion, 4 wt%, Purity: > 95%, OD: 8-16 nm, Length: 45 µm |
| Multi Walled Carbon Nanotubes Ethanol Dispersion, 4 wt%, Purity: > 96%, OD: 3-13 nm, Length: 45 µm |
| Carbon Nanotubes Metal Films with Nickel (Ni) 12 wt%, Thickness: 18 µm, Dia: 47 mm |
| Multi Walled Carbon Nanotubes Isopropanol Dispersion, 4wt%, Purity: > 96%, OD: 4-12 nm, Length: 55 µm |
| Multi Walled Carbon Nanotubes N-Methyl-2-Pyrrolidinone Dispersion, 4 wt%, Purity: > 96%, OD: 4-13 nm, Length: 45 µm |
| Multi Walled Carbon Nanotubes Isopropanol Dispersion, 4 wt%, Purity: > 95%, OD: 18-35 nm, Length: 8-18 µm |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size:3”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 1”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 4”, Thickness: 0.250” |
| Boron Doped Graphene Nanopowder (B/G) |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Quartz Wafer, (AT-Cut), Size: 4”, 2-Side Polished, Thickness: 500 ± 25 μm |
| Quartz Wafer, (ST-Cut), Size: 4”, 1-Side Polished, Thickness: 625 ± 25 μm |
| Carbon Nanotube Wire, Diameter: 30-50 μm, Hardness: 1.0-1.5 GPa |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Quartz Wafer, (X-Cut), Size: 4”, 2-Side Polished, Thickness: 300 ± 25 μm |
| Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Sn:Cu/9:1 |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 3”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 3”, Thickness: 0.125” |
| Water-_20_.webp |
| Diamond (C) Nanopowder/Nanoparticles, Purity: 99%, Size: 10 nm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 4”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”, Grey to Black |
| Germanium (Ge) Micron Powder, Purity: 99.99 %, Size: 100 mesh |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Magnesium (Mg) Micron Powder, Purity: 99.9%, Size: 0-200 µm |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW120 |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Aluminum Laminated Film for Pouch Cell Case |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| PTFE Separator Film for Battery Applications Thickness: 50μm, Width: 60mm, Length: 600 m, 1 roll: 600 m |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 20 mm x 20 mm, Thickness: 1-2 mm |
| Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 130 ppm Dry powder |
| Li-Ion Battery Separator Film, Thickness: 25 μm, Width: 60 mm, Length: 500 m, 1 Roll: 500 m |
| Copper Zinc (Cu-Zn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Cu:Zn/6:4 |
| Iron Nickel (Fe-Ni) Alloy Nanopowder/Nanoparticles, Size: 30-90 nm, Fe:Ni/5:5 |
| Copper Zinc (Cu-Zn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Cu:Zn/5:5 |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Magnesium (Mg) Micron Powder, Purity: 99.9%, Size: 0-100 µm |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Germanium (Ge) Micron Powder, Purity: 99.99 %, Size: 5 µm |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW60 |
| Fullerene-C60, Purity: 95% |
| Nickel (Ni) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 4”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 1”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 2”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 50 mm x 10 mm, Thickness: 1-2 mm |
| Carbon Nanotube Fibres, Fiber diameter: 5-12 µm, Tensile Strength: 800-1000 MPa, Electrical conductivity: 5×10^4~7×10^4 S/m |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Carbon Nanotube Wire, Diameter: 60-100 μm, Hardness: 350-500 MPa |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Carbon Nanotube Wire, Diameter: 120-150 μm, Hardness: 350-500 MPa |
| Iron (II) Acetate Fe(C2H3O2)2, Purity: > 95% |
| Nickel Foil, Purity: 99.9+% , Thickness: 0.03mm, Width: 100mm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Indium (In) Micron Powder, Purity:99.99%, APS:1-5 µm, Spherical |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Iron Chromium Cobalt (Fe-Cr-Co) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Fe:Cr:Co/64:25:11 |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size:4”, Thickness: 0.125” |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 18 nm, Laser Synthesized |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”, Grey to Black |
| Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125”, Dark Gray to Black |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Carbon Nanotube Sponges, Size: 20 mm x 20 mm, Thickness: 3-4 mm |
| Borosilicate Wafer, Size: 8”, 2-Side Polished, Thickness: 1250 ± 25 μm |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Fullerene-C60, Purity: 98% |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 100, Single Side Polished, Testing Grade |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Nickel Foil, Purity: 99.9+% , Thickness: 0.08mm, Width: 100mm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”, White to Gray |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientaion: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 380± 15 μm, Coating 1000 nm |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 4”, Thickness: 0.250” |
| Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Chromium Aluminum Boride (Cr2AlB2) Max Phase Powder, Purity: 99+%, Size: 200 mesh |
| Shape Memory Polymer NGM9020, Ether Type |
| Platinum (Pt) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 15 nm |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Copper-Carbon Nanotube Fibers Composite Wires, Cu-CNT, Diameter: 10-30 µm, Coating Thickness: 1 µm, Electrical conductivity: 1×10^7 S/m |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 6”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Shape Memory Polymer NGM7520, Ether Type |
| Fullerene-C60, Purity: 99% |
| Shape Memory Polymer NGS2520, Solution Type |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350±25 μm, Orientation: 100, Single Side Polished, EPI-Ready |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW40 |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 250 ppm Dry powder |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 111, Single Side Polished, EPI-Ready |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Iron Aluminum Boride (Fe2AlB2) Max Phase Powder, Purity: 99+%, Size: 200 mesh |
| Silver-Carbon Nanotube Fibers Composite Wires, Ag-CNT, Diameter: 10-30 µm, Coating Thickness: 1 µm, Electrical conductivity: 1.5×10^7 S/m |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 1”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Gold (Au) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 50-100 nm |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Quartz Wafer, (X-Cut), Size: 4”, 2-Side Polished, Thickness: 200 ± 25 μm |
| Hafnium Oxide (HfO2) Pellet, Granule Type, Color: Black, Purity: 99.99%, Size: 1-3mm |
| Hafnium Oxide (HfO2) Pellet, Granule Type, Color: White, Purity:99.99%, Size:1-3mm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 8”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 450±25 μm, Single Side Polished, EPI-ready, Dopant: Silicon (N Type) |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Sulphur (S) Nanopowder/Nanoparticles, High Purity: 99.995%, Size: 47 nm |
| Fullerene-C60, Purity: 99.5% |
| Shape Memory Polymer NGM6520, Ether Type |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 6”, Thickness: 0.250” |
| Shape Memory Polymer NGM5520, Ether Type |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, indium, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250”, Dark Gray to Black |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Manganese (Mn) Sputtering Targets, indium, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”, White to Gray |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Graphene Sheet, Size: 29 cm x 39 cm, Thickness: 35 µm, Highly Conductive |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Shape Memory Polymer NGM4520, Ether Type |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”, Grey to Black |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 38 nm, Metal Basis |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 450 nm |
| Thermoplastic Carbon Paste, Drying Temperature: <100 °C |
| Quantum Dots Magnetic Microspheres 615 nm |
| Quantum Dots Magnetic Microspheres 525 nm |
| Quantum Dots Microspheres 615 nm |
| Quantum Dots Microspheres 525 nm |
| Water Soluble Carbon Quantum Dots 528 nm |
| Water Soluble Carbon Quantum Dots 515 nm |
| Water Soluble Carbon Quantum Dots 505 nm |
| Water Soluble Carbon Quantum Dots 420 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 645 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 625 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 545 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 525 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 500 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 470 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 700 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 625 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 600 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 560 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 525 nm |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Double Side Polished, EPI-ready, Dopant: Zinc (P Type) |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 50 mm x 10 mm, Thickness: 3-4 mm |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Bismuth (Bi) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 78 nm, Metal Basis |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silver Conductive Paste, Surface Curing: ~80℃ |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 400±25 μm, Double Side Polished, EPI-ready |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Thermoplastic Carbon Paste for Long-term Cell Degradation |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8”, Thickness: 0.250” |
| Carbon Nanotube Wire, Diameter: 5-15 μm, Hardness: 1.0-1.5 GPa |
| High-Performance Copper Foil Rolls for Lithium Ion Battery, Size: 10 µm |
| Cobalt Oxalate (CoC2O4), Purity: > 98% |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW20 |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Fullerene-C60, Purity: 99.9% |
| Meshed Lithium Air CR2032 Coin Cell Case with 304SS, Diameter: 20 mm, Height: 3.2 mm |
| Thermoset Carbon Paste (140 ℃, 100 ohm/sqr/25µm), 15-20 µm |
| Thermoset Carbon Paste (140 ℃, 1000 ohm/sqr/25µm, 10-15 µm) |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Thermoplastic Carbon Paste, Drying Temperature: 120˚C for 10 minutes |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness:0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Shape Memory Polymer NGM2520, Ether Type |
| Thermoset Carbon Paste (140℃, <20 ohm/sqr/25µm), 10-12 µm |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”, Grey to Black |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125”, Grey to Black |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Hydrothermal Synthesis Autoclave Reactor with PTFE Lined Vessel 500 ml |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.125” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”, Grey to Black |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 3”, Thickness: 0.125” |
| Gold (Au) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 28 nm |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, elastomer, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.125” |
| Carbon Nanotube Fibres, Fiber Diameter: 5-12 µm, Tensile Strength 1000-1200 MPa, Electrical conductivity 5×10^4~7×10^4 S/m |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Lithium Nickel Cobalt Oxide (LiNi(1-x)CoxO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250”, Grey to Black |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| High-Performance Copper Foil Rolls for Lithium Ion Battery, Size: 25 µm |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Indium (In) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 70 nm, Tetragonal |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 8”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”, Beige to White |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Li-Ion Battery Separator Film, Length: 800 m, Width: 85 mm, Thickness: 25 μm |
| Stainless Steel Two-Electrode Split Test Cell |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Zinc Selenide Quantum Dots (ZnSe/ZnS QD) 450 nm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 700 nm |
| Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 500 ppm Dry powder |
| Gold-Carbon Nanotube Fibers Composite Wires, Au-CNT, Diameter: 10-30 µm, Coating Thickness: 1 µm, Electrical conductivity: 1×10^7 S/m |
| Indium Phosphide Quantum (InP/ZnS QD) Dots 625 nm |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Zinc Selenide Quantum Dots (ZnSe/ZnS QD) 420 nm |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.250” |
| Gold (Au) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 14 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 4”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Indium Phosphide Quantum (InP/ZnS QD) Dots 600 nm |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5, Size: 8”, Thickness: 0.250” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Electrolyte Lithium Hexafluorophosphate (LiPF6) for Lithium-ion Battery Research Development, 1 Kg in Stainless Steel Container |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 560 nm |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”, Beige to White |
| Silver Nanowires Suspension in Ethanol, Purity: > 99 wt%, Diameter : 50 nm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”, White to Gray |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 525 nm |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125”, Grey to Black |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Hydrothermal Synthesis Autoclave Reactor with PPL Lined Vessel 500 ml |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 480 nm |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.98%, Size:2”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Shape Memory Polymer NGM3520, Ether Type |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 7”, Thickness: 0.250” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 1”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Lithium (Li) Foil Thickness:0.5 mm, Width: 50 mm, Length: 1000 mm, Purity: 99.9% |
| Vanadium Oxide (VO2) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 30-60 nm |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 3”, Thickness: 0.250” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 645 nm |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”, Grey to Black |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”, Dark Gray to Black |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 625 nm |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lithium Nickel Cobalt Oxide (LiNi(1-x)CoxO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Single Side Polished, EPI-ready |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 640±25 μm, Single Side Polished, EPI-ready, Dopant: Silicon (N-type) |
| Tungsten (W) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 545 nm |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”, Grey to Black |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Multi Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 960 µm |
| Multi Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 180 µm |
| Multi Walled Carbon Nanotubes Array on Polycrystal Silicon, Height: 960 µm |
| Multi Walled Carbon Nanotubes Array on Quartz, Height: 960 µm |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 525 nm |
| Multi Walled Carbon Nanotubes Array on Quartz, Height: 490 µm |
| Multi Walled Carbon Nanotubes Array on Quartz, Height: 95 µm |
| Multi Walled Carbon Nanotubes Array on Polycrystal Silicon, Height: 95 µm |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Carbon Nanotube Fibres, Fiber Diameter: 5-12 µm, Tensile Strength 1200-1500 MPa, Electrical conductivity 5×10^4~7×10^4 S/m |
| Multi Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 95 µm |
| Chromium Oxide (Cr2O3) Sputtering Targets, indium, Purity: 99.8%, Size: 2”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Multi Walled Carbon Nanotubes Array on Polycrystal Silicon, Height: 490 µm |
| Carbon Nanotube Sponges, Size: 50 mm x 20 mm, Thickness: 1-2 mm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 480 nm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125”, Dark Gray to Black |
| Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 460 nm |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Aluminate (LaAlO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Titanium Boride (TiB2) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”, Beige to White |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 8”, Orientation: (100), Boron Doped, Resistivity: 1-100 (ohm.cm), 1-Side Polished, Thickness: 725 ± 25 μm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| CQD-675-nm.webp |
| Carbon Quantum Dots (CQD) 675 nm |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Quantum Dots (CQD) 630 nm |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 1000 ppm Dry powder |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 4”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 3”, Thickness: 0.125” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Single Side Polished, EPI-ready, Mobility: 1000-3000 |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Double Side Polished, EPI-ready |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 100, Single Side Polished, EPI-ready |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 625±25 μm, Single Side Polished, EPI-ready |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 350±25 μm, Single Side Polished, EPI-ready |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9% , Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, elastomer, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| 565.webp |
| Carbon Quantum Dots (CQD) 565 nm |
| Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size:2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 5×5 cm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Samarium (Sm) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| 535.webp |
| Carbon Quantum Dots (CQD) 535 nm |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 2”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cobalt (Co) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 100 nm |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| 515.webp |
| Carbon Quantum Dots (CQD) 515 nm |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Lead Sulfide Quantum Dots (PbS QD) 1550 nm |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| 505.webp |
| Carbon Quantum Dots (CQD) 505 nm |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.99%, Size: 1”, Thickness: 0.125”, Beige to White |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| 440.webp |
| Carbon Quantum Dots (CQD) 440 nm |
| Lead Sulfide Quantum Dots (PbS QD) 1450 nm |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 600±25 μm, Double Side Polished, EPI-ready |
| Perovskite Quantum Dots (CsPbI3) 670 nm |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:2”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Lanthanum Aluminate (LaAlO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lead Sulfide Quantum Dots (PbS QD) 1350 nm |
| Fullerene-C70, Purity: 95% |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| 420.webp |
| Carbon Quantum Dots (CQD) 420 nm |
| Lead Sulfide Quantum Dots (PbS QD) 1250 nm |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 4”, Thickness: 0.250” |
| Lead Sulfide Quantum Dots (PbS QD) 1150 nm |
| Perovskite Quantum Dots (CsPbCl3) 410 nm |
| Perovskite Quantum Dots (CsPbBr3) 510 nm |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”, Beige to White |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lead Sulfide Quantum Dots (PbS QD) 1050 nm |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Molybdenum Oxide (MoO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lead Sulfide Quantum Dots (PbS QD) 950 nm |
| Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 50 mm x 20 mm, Thickness: 3-4 mm |
| Lead Sulfide Quantum Dots (PbS QD) 850 nm |
| Germanium (Ge) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size:1”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 3”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, elastomer, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” , Grey to Black |
| Strontium Titanate (SrTiO3) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, elastomer, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Fullerene-C70, Purity: 96% |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125”, Grey to Black |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafer, Size: 4”, Thickness: 300± 25 μm, Double Side Polished, EPI-ready |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Indium Bonding, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| InP-based QLED Quantum Dots 525 nm |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Cd-based QLED Quantum Dots 465 nm |
| Cd-based QLED Quantum Dots 525 nm |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Cd-based QLED Quantum Dots 625 nm |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| ZnSe-based QLED Quantum Dots 455 nm |
| InP-based QLED Quantum Dots 625 nm |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, indium, Purity: 99.8%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Multi-Layer Accordion-Shaped Titanium Carbide ( Ti3C2Tx) MXene Phase Powder, Purity: 98+%, Size: ~400 mesh |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125”, Beige to White |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”, Beige to White |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Gold Nanostars, Size: 40-45 nm |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125”, Grey to Black |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, elastomer, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Fullerene-C70, Purity: 98% |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.98%, Size: 2”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Silicon Carbide Wafer (SiC-4H) – 4H , Size: 2”, Thickness: 350 μm, Mechanical Grade, 4H Area: 80% |
| Single Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 95 µm |
| Single Walled Carbon Nanotubes Array on Quartz, Height: 190 µm |
| Single Walled Carbon Nanotubes Array on Quartz, Height: 290 µm |
| Single Walled Carbon Nanotubes Array on Quartz, Height: 95 µm |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Chips for Coin Cell Materials, Diameter: 16 mm, Thickness: 0.6 mm, 1500 pieces |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 4”, Thickness: 0.125” |
| Fullerene-C70, Purity: 99% |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”, Beige to White |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%, Size: 4”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Single Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 190 µm |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size:4”, Thickness: 0.250” |
| Calcium Manganate (CaMnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Stainless Steel Three-Electrode Split Test Cell |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 2000 ppm Dry powder |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Praseodymium (Pr) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Magnetic Fe3O4@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Positively-charged |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Cerium (Ce) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 5×10 cm |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”, Beige to White |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Mini Pellet Press |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”, Beige to White |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Glassy Carbon Foam for Battery and Supercapacitor Research, Purity: 95+%, Size: 100 mm x100 mm x 10 mm |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250”, Beige to White |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”, Beige to White |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc Selenide Discs, Purity: 99.99%, Dia:20mm, Thickness:3mm, 2-side polished |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 111, Single Side Polished, Testing Grade |
| Multi-Layer Titanium Carbide (Ti2CTx) MXene Phase Powder, Purity: 98+%, Size: 2-20 µm |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Selenium (Se) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: < 100 nm |
| Silicon Carbide Wafer (SiC-4H)- 4H, Size: 2”, Thickness: 350 μm, Mechanical Grade, 4H Area: 95% |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 2”, Thickness: 350 μm, Testing Grade, 4H Area: 80% |
| Fullerene-C70, Purity: 99.5% |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Production Grade, 4H Area: 100% |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| 5V-10mA Coin Cell Battery Testing System, Dimension ( W*L*H) : 480*330*45 mm |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 4000 ppm Dry powder |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Testing Grade, 4H Area: 95% |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”, Beige to White |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Dummy Grade, 4H Area: 95% |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 111, Testing Grade |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 100, Testing Grade |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| High Speed Homogenizer, 27.000 rpm |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Silicon Nanowires, Dia: 100-200nm, Length: >10um, Purity: 99% |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.99%, Size: 4”, Thickness: 0.125”, Beige to White |
| Platinum Foil, Purity 99.95%, Thickness: 0.5mm, 5×5 cm |
| Fullerene-C70, Purity: 99.9% |
| Coin Cell Punching Machine |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 111, Single Side Polished, Testing Grade |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 100, Single Side Polished, Testing Grade |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Silicon Carbide Wafer (SiC-6H) – 6H , Size: 2”, Thickness: 350 μm, Dummy Grade, Usable Area: 95% |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Silicon Carbide Wafer (SiC-4H)- 4H , Size: 4”, Thickness: 350 μm, Dummy Grade, 4H Area: 95% |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 4”, Thickness: 350 μm, Mechanical Grade, 4H Area: 80% |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 111, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 100, EPI-Ready |
| Platinum (Pt) Sputtering Targets, indium, Purity: 99.99%, Size:2”, Thickness: 0.125” |
| Hydraulic Crimping Machine for All Coin Cells |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 2”, Thickness: 350 μm, Production Grade, 4H Area: 1 |
| Shape Memory Polymer NGP4510, Potting Type |
| Shape Memory Polymer NGP5510, Potting Type |
| Shape Memory Polymer NGP3510, Potting Type |
| Shape Memory Polymer NGP2510, Potting Type |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 4”, Thickness: 350 μm, Mechanical Grade, 4H Area: 100% |
| Indium Arsenide (InAs) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 100, EPI-Ready |
| Platinum Foil, Purity 99.95%, Thickness: 1 mm, 5×5 cm |
| Platinum (Pt) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 111, Single Side Polished, EPI-Ready |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 100, Single Side Polished, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 100, Testing Grade |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 111, Single Side Polished, Testing Grade |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 100, Single Side Polished, Testing Grade |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 100, Single Side Polished, EPI-Ready, Dopant: Iron (N Type) |
| Silicon on Insulator (SOI) Wafers, Size: 4”, Thickness: 725 μm, P type (Boron doped) |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 111 , Single Side Polished, EPI-Ready, Dopant: Iron (N Type) |
| Electric Coin Cell Hydraulic Crimping Machine |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Research Grade, 4H Area: 95% |
| Pneumatic Cylindrical Battery Sealing Machine |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 4”, Thickness: 350 μm, Testing Grade, 4H Area: 95% |
| Ultrasonic Homogenizer |
| High Energy Ball Mill |
| Indium Arsenide (InAs) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 100, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 100, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 111, Testing Grade |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 111, EPI-Ready |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Silicon on Insulator (SOI) Wafers, Size: 6”, Device Thickness: 625 nm, P type |
| Silicon on Insulator (SOI) Wafers, Size: 8”, Device Thickness: 300 nm, P type |
| Silicon on Insulator (SOI) Wafers, Size: 8”, Device Thickness: 600 nm, P type |
| Silicon on Insulator (SOI) Wafers, Size: 6”, Device Thickness: 340 nm, P type |
| Pneumatic Die Cutting Machine For Battery Electrode Cutting |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Gallium Antimonide (GaSb) Wafers, Size: 4”, Thickness: 1000± 25 μm, Orientation: 100, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 4”, Thickness: 1000± 25 μm, Orientation: 111, EPI-Ready |
| Indium Arsenide (InAs) Wafers, Size: 4”, Thickness: 1000± 25 μm, Orientation: 100, EPI-Ready |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dry powder |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Shape Memory Polymer NGS5520, Solution Type |
| Shape Memory Polymer NGS4520, Solution Type |
| Shape Memory Polymer NGS3520, Solution Type |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 100, Single Side Polished, EPI-Ready |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 111, Single Side Polished, EPI-Ready |
| Platinum Foil, Purity 99.95%, Thickness: 0.5mm, 10×10 cm |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Platinum Foil, Purity 99.95%, Thickness: 1 mm, 10×10 cm |
| Large-Automatic-Film-Coater-_Doctor-Blade_.webp |
| Large Automatic Film Coater (Doctor Blade) |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |