What is Tungsten (W) Sputtering Targets?
Tungsten (W) sputtering targets are high-purity tungsten materials used for thin-film deposition in semiconductor, microelectronics, and optical applications. Due to tungsten’s high melting point, density, and conductivity, it is widely used in high-performance coating applications.
Chemical Properties and CAS Number
- Material: Tungsten (W)
- CAS Number: 7440-33-7
- Purity: 99.95% (3N5) to 99.999% (5N)
- Appearance: Silver-gray metallic solid
- Density: 19.25 g/cm³
- Melting Point: 3,422°C
- Thermal Conductivity: 173 W/m·K
- Form: Circular, rectangular, or custom-shaped sputtering targets
Applications of Tungsten (W) Sputtering Targets
1. Semiconductor and Microelectronics
Used in integrated circuits (ICs), transistors, and advanced semiconductor devices for enhanced electrical performance.
2. Thin-Film Solar Cells
Serves as a conductive back contact layer in photovoltaic cells to improve efficiency and durability.
3. Optical and Wear-Resistant Coatings
Applied in optical mirrors, anti-reflective coatings, and high-temperature protective layers.
4. Flat Panel Displays (FPDs) and OLEDs
Used in the production of thin-film coatings for display panels and organic light-emitting diodes (OLEDs).
5. Aerospace and Defense Applications
Utilized in high-temperature-resistant coatings for aerospace components and thermal barrier coatings.
Pricing of Tungsten (W) Sputtering Targets
Pricing depends on purity, dimensions, and order volume:
- Standard Purity (3N5, 99.95%): Typically $200 – $800 per piece
- High-Purity (5N, 99.999%): Ranges from $800 – $2,500 per piece
- Custom Sizes and Bulk Orders: Prices vary based on customization and supplier agreements
Factors Influencing Pricing
- Purity level (3N5 vs. 5N tungsten)
- Target thickness and diameter
- Customization options
- Market demand in semiconductor and aerospace industries
Conclusion
Tungsten (W) Sputtering Targets are essential for high-performance coatings in semiconductors, optical applications, and aerospace, ensuring durability and efficiency in thin-film deposition.
